Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387200 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing, Yoshihiro Tomita, Vijay K. Nair | 2022-07-12 |
| 11335651 | Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric | Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Shawna M. Liff, Yoshihiro Tomita | 2022-05-17 |
| 11296052 | TSV-less die stacking using plated pillars/through mold interconnect | Preston T. Meyers, Shawna M. Liff, Joe Saucedo, Adel A. Elsherbini, Albert S. Lopez +1 more | 2022-04-05 |