Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462527 | Micro-trenching mold interface in a pop package | Kumar Abhishek Singh, Thomas J. Debonis, Robert M. Nickerson, Rees WINTERS | 2022-10-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462527 | Micro-trenching mold interface in a pop package | Kumar Abhishek Singh, Thomas J. Debonis, Robert M. Nickerson, Rees WINTERS | 2022-10-04 |