Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404364 | Multi-layer embedded magnetic inductor coil | Kaladhar Radhakrishnan, Krishna Bharath, Yikang Deng, Amruthavalli Pallavi Alur | 2022-08-02 |
| 11393751 | Package-integrated multi-turn coil embedded in a package magnetic core | Kaladhar Radhakrishnan, Krishna Bharath, Yikang Deng, Amruthavalli Pallavi Alur | 2022-07-19 |
| 11357096 | Package substrate inductor having thermal interconnect structures | Michael J. Hill, Anne Augustine | 2022-06-07 |
| 11335620 | Package inductor having thermal solution structures | Michael J. Hill, Anne Augustine, William J. Lambert | 2022-05-17 |