Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527489 | Apparatus and system with package stiffening magnetic inductor core and methods of making the same | Mathew J. Manusharow, Beomseok Choi, Digvijay A. Raorane | 2022-12-13 |
| 11437346 | Package structure having substrate thermal vent structures for inductor cooling | Leigh E. Wojewoda, Mathew J. Manusharow, Siddharth Kulasekaran | 2022-09-06 |
| 11380652 | Multi-level distributed clamps | Beomseok Choi, Kaladhar Radhakrishnan, William J. Lambert, Krishna Bharath | 2022-07-05 |
| 11357096 | Package substrate inductor having thermal interconnect structures | Huong Do, Anne Augustine | 2022-06-07 |
| 11335620 | Package inductor having thermal solution structures | Anne Augustine, Huong Do, William J. Lambert | 2022-05-17 |
| 11215662 | Method, device and system to protect circuitry during a burn-in process | William J. Lambert, Kaladhar Radhakrishnan | 2022-01-04 |