Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11357096 | Package substrate inductor having thermal interconnect structures | Michael J. Hill, Huong Do | 2022-06-07 |
| 11335620 | Package inductor having thermal solution structures | Michael J. Hill, Huong Do, William J. Lambert | 2022-05-17 |