Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437346 | Package structure having substrate thermal vent structures for inductor cooling | Michael J. Hill, Mathew J. Manusharow, Siddharth Kulasekaran | 2022-09-06 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437346 | Package structure having substrate thermal vent structures for inductor cooling | Michael J. Hill, Mathew J. Manusharow, Siddharth Kulasekaran | 2022-09-06 |