Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456232 | Thermal assemblies for multi-chip packages | Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Shankar Devasenathipathy, Chandra Mohan Jha | 2022-09-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456232 | Thermal assemblies for multi-chip packages | Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Shankar Devasenathipathy, Chandra Mohan Jha | 2022-09-27 |