Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11328978 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Feras Eid, Johanna M. Swan, Sergio Antonio Chan Arguedas | 2022-05-10 |
| 11328979 | Substrate integrated posts and heat spreader customization for enhanced package thermomechanics | Feras Eid, Dinesh Padmanabhan Ramalekshmi Thanu, Sergio Antonio Chan Arguedas, Johanna M. Swan | 2022-05-10 |