Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373951 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh +2 more | 2022-06-28 |
| 11322444 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie +1 more | 2022-05-03 |
| 11309192 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Aleksandar Aleksov | 2022-04-19 |
| 11264307 | Dual-damascene zero-misalignment-via process for semiconductor packaging | Aleksandar Aleksov, Hiroki Tanaka, Robert Alan May, Kristof Darmawikarta, Changhua Liu +2 more | 2022-03-01 |