Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532584 | Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Srinivas V. Pietambaram, Javier Soto Gonzalez +1 more | 2022-12-20 |
| 11533024 | Multi-zone radio frequency transistor amplifiers | Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard, Alexander Komposch | 2022-12-20 |
| 11356070 | RF amplifiers having shielded transmission line structures | Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard, Alexander Komposch | 2022-06-07 |