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Multi-zone radio frequency transistor amplifiers |
Kwangmo Chris Lim, Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard |
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High reliability semiconductor devices and methods of fabricating the same |
Sung Chul Joo, Brian Condie, Benjamin P. Law, Jae Hyung Park |
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Multi-cavity package having single metal flange |
Saurabh Goel, Cynthia Blair, Cristian Gozzi |
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| 11430744 |
Die-attach method to compensate for thermal expansion |
David Seebacher, Christian Schuberth, Peter Singerl |
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Integrated circuit having die attach materials with channels and process of implementing the same |
Mitch Flowers, Erwin B. Cohen |
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| 11367696 |
Radio frequency amplifiers having improved shunt matching circuits |
Simon Ward, Richard Wilson |
2022-06-21 |
| 11356070 |
RF amplifiers having shielded transmission line structures |
Kwangmo Chris Lim, Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard |
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| 11289378 |
Methods for dicing semiconductor wafers and semiconductor devices made by the methods |
Kevin Shawne Schneider |
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| 11257740 |
Device carrier configured for interconnects, a package implementing a device carrier having interconnects, and processes of making the same |
Simon Ward, Madhu Chidurala |
2022-02-22 |