Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424177 | Integrated circuit having die attach materials with channels and process of implementing the same | Erwin B. Cohen, Alexander Komposch | 2022-08-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424177 | Integrated circuit having die attach materials with channels and process of implementing the same | Erwin B. Cohen, Alexander Komposch | 2022-08-23 |