Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508662 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Islam A. Salama, Kristof Darmawikarta | 2022-11-22 |
| 11495555 | Magnetic bilayer structure for a cored or coreless semiconductor package | Yikang Deng, Andrew J. Brown, Junnan Zhao | 2022-11-08 |
| 11276618 | Bi-layer prepreg for reduced dielectric thickness | Andrew J. Brown | 2022-03-15 |