Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450629 | Intra-semiconductor die communication via waveguide in a multi-die semiconductor package | Kemal Aygun, Jian Yong XIE | 2022-09-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450629 | Intra-semiconductor die communication via waveguide in a multi-die semiconductor package | Kemal Aygun, Jian Yong XIE | 2022-09-20 |