Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11367707 | Semiconductor package or structure with dual-sided interposers and memory | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan | 2022-06-21 | $17,814,000 |
| 11336559 | Fast-lane routing for multi-chip packages | Adel A. Elsherbini, Tejpal Singh, Shawna M. Liff, Johanna M. Swan | 2022-05-17 | $14,251,000 |
| 11294852 | Multiple dies hardware processors and methods | Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Siva Soumya Eachempati, Tejpal Singh +10 more | 2022-04-05 | $18,322,000 |
| 11270947 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan | 2022-03-08 | $16,017,000 |