Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Composite interposer structure and method of providing same

Composite interposer structure and method of providing same

US Patent 11270947 · Granted Mar 8, 2022

Estimated economic value: $16,017,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

On-package die-to-die (D2D) interconnect for memory using universal chiplet inte2025
Retimers to extend a die-to-die interconnect2025
Die-to-die interconnect protocol layer2025
Microelectronic assemblies with communication networks2025
Microelectronic assemblies with communication networks2025
Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Clock interpolation system for eye-centering2025
Apparatus and method of manufacturing a vertically disaggregated photonic device2025
Cooling of conformal power delivery structures2025