Issued Patents 2022
Showing 51–62 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282812 | Thermal management solutions for stacked integrated circuit devices using jumping drops vapor chambers | Adel A. Elsherbini, Feras Eid | 2022-03-22 |
| 11270947 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Liff, Gerald Pasdast | 2022-03-08 |
| 11264373 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Veronica Strong | 2022-03-01 |
| 11239155 | Conductive contact structures for electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Aleksandar Aleksov, Veronica Strong | 2022-02-01 |
| 11234343 | Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices | Feras Eid, Adel A. Elsherbini | 2022-01-25 |
| 11227859 | Stacked package with electrical connections created using high throughput additive manufacturing | Feras Eid, Shawna M. Liff | 2022-01-18 |
| 11226162 | Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections | Feras Eid, Adel A. Elsherbini | 2022-01-18 |
| 11222836 | Zero-misalignment two-via structures | Veronica Strong, Aleksandar Aleksov, Brandon M. Rawlings | 2022-01-11 |
| 11223524 | Package integrated security features | Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Georgios Dogiamis +1 more | 2022-01-11 |
| 11222863 | Techniques for die stacking and associated configurations | Fay Hua, Christopher M. Pelto, Valluri Rao, Mark Bohr | 2022-01-11 |
| 11222856 | Package-integrated bistable switch for electrostatic discharge (ESD) protection | Feras Eid, Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini | 2022-01-11 |
| 11217535 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff | 2022-01-04 |