Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515248 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2022-11-29 |
| 11444033 | Hybrid microelectronic substrate and methods for fabricating the same | Robert L. Sankman, Scott M. Mokler, Richard C. Stamey | 2022-09-13 |