Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515248 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2022-11-29 |
| 11257688 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | Robert L. Sankman | 2022-02-22 |