Issued Patents All Time
Showing 76–100 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559076 | Package having substrate with embedded metal trace overlapped by landing pad | Mirng-Ji Lii, Yu-Min Liang | 2017-01-31 |
| 9559069 | Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof | Chen-Shien Chen, Sheng-Yu Wu, Tin-Hao Kuo, Yen-Liang Lin | 2017-01-31 |
| 9553065 | Bumps for chip scale packaging including under bump metal structures with different diameters | Chun-Hung Lin, Tsung-Shu Lin, Han-Ping Pu, Hsien-Wei Chen | 2017-01-24 |
| 9508637 | Protrusion bump pads for bond-on-trace processing | Chen-Shien Chen, Yu-Wei Lin, Tin-Hao Kuo, Yu-Min Liang, Chun-Hung Lin | 2016-11-29 |
| 9502360 | Stress compensation layer for 3D packaging | Chun-Hung Lin, Han-Ping Pu, Hung-Jui Kuo | 2016-11-22 |
| 9484317 | Scheme for connector site spacing and resulting structures | Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2016-11-01 |
| 9472524 | Copper-containing layer on under-bump metallization layer | Chun-Hung Lin, Han-Ping Pu, Chih-Hang Tung, Kai-Chiang Wu, Ming-Che Ho | 2016-10-18 |
| 9418947 | Mechanisms for forming connectors with a molding compound for package on package | Chun-Hung Lin, Han-Ping Pu, Ming-Da Cheng, Kai-Chiang Wu | 2016-08-16 |
| 9418956 | Zero stand-off bonding system and method | Chun-Hung Lin, Ming-Che Ho, Yi-Wen Wu, Hsien-Liang Meng, Han-Ping Pu | 2016-08-16 |
| 9406634 | Package structure and method of forming the same | Yuh Chern Shieh, Han-Ping Pu, Tin-Hao Kuo | 2016-08-02 |
| 9397080 | Package on package devices and methods of packaging semiconductor dies | Chun-Lei Hsu, Ming-Che Ho, De-Yuan Lu, Chung-Shi Liu | 2016-07-19 |
| 9391012 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Hsien-Wei Chen, Chun-Hung Lin, Ming-Kai Liu, Chun-Lin Lu | 2016-07-12 |
| 9379032 | Semiconductor packaging having warpage control and methods of forming same | Yu-Chih Huang, Chun-Cheng Lin, Kuei-Wei Huang, Chen-Shien Chen | 2016-06-28 |
| 9355928 | Package-on-package structure | Han-Ping Pu, Chun-Hung Lin, Chun-Cheng Lin, Ming-Da Cheng, Kai-Chiang Wu | 2016-05-31 |
| 9305890 | Package having substrate with embedded metal trace overlapped by landing pad | Mirng-Ji Lii, Yu-Min Liang | 2016-04-05 |
| 9293404 | Pre-applying supporting materials between bonded package components | Yu-Chen Hsu, Han-Ping Pu, Meng-Tse Chen, Guan-Yu Chen | 2016-03-22 |
| 9209140 | Semiconductor devices and methods of manufacture thereof | Kai-Chiang Wu, Chun-Lin Lu, Hung-Jui Kuo | 2015-12-08 |
| 9190348 | Scheme for connector site spacing and resulting structures | Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2015-11-17 |
| 9159686 | Crack stopper on under-bump metallization layer | Chun-Hung Lin, Han-Ping Pu, Chih-Hang Tung, Kai-Chiang Wu, Ming-Che Ho | 2015-10-13 |
| 9093332 | Elongated bump structure for semiconductor devices | Tin-Hao Kuo, Chen-Shien Chen, Chen-Hua Yu, Sheng-Yu Wu, Chita Chuang | 2015-07-28 |
| 9064880 | Zero stand-off bonding system and method | Chun-Hung Lin, Ming-Che Ho, Yi-Wen Wu, Hsien-Liang Meng, Han-Ping Pu | 2015-06-23 |
| 9041223 | Bump-on-trace (BOT) structures | Yuh Chern Shieh, Han-Ping Pu, Tin-Hao Kuo | 2015-05-26 |
| 8994176 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Hsien-Wei Chen, Chun-Hung Lin, Ming-Kai Liu, Chun-Lin Lu | 2015-03-31 |
| 8981559 | Package on package devices and methods of packaging semiconductor dies | Chun-Lei Hsu, Chung-Shi Liu, De-Yuan Lu, Ming-Che Ho | 2015-03-17 |
| 8970024 | Packages with molding material forming steps | Yu-Chen Hsu, Chun-Hung Lin, Han-Ping Pu | 2015-03-03 |