Issued Patents All Time
Showing 51–75 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997480 | Method of forming a semiconductor device including strain reduced structure | Hsien-Wei Chen, Ying-Ju Chen, Tsung-Yuan Yu, Tsung-Ding Wang | 2018-06-12 |
| 9943239 | Optical sensing system and associated electronic device | Hung-Yi Kuo, Hao-Yi Tsai, Hsien-Ming Tu, Shih-Wei Liang, Chang-Pin Huang +2 more | 2018-04-17 |
| 9941140 | Semiconductor devices and methods of manufacture thereof | Kai-Chiang Wu, Chun-Lin Lu, Hung-Jui Kou | 2018-04-10 |
| 9935081 | Hybrid interconnect for chip stacking | Kuo Lung Pan, Chen-Shien Chen, Mirng-Ji Lii | 2018-04-03 |
| 9935073 | Semiconductor structure and manufacturing method of the same | Yen-Liang Lin, Mirng-Ji Lii, Tin-Hao Kuo, Chen-Shien Chen, Sheng-Yu Wu | 2018-04-03 |
| 9917068 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Hao-Cheng Hou, Jung Wei Cheng, Yu-Min Liang, Tsung-Ding Wang | 2018-03-13 |
| 9911724 | Multi-chip package system and methods of forming the same | Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2018-03-06 |
| 9904776 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Hao-Yi Tsai +2 more | 2018-02-27 |
| 9898645 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Hao-Yi Tsai +2 more | 2018-02-20 |
| 9881850 | Package structures and method of forming the same | Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai | 2018-01-30 |
| 9875388 | Fingerprint sensor device and method | Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu | 2018-01-23 |
| 9871013 | Contact area design for solder bonding | Pei-Chun Tsai, Tin-Hao Kuo, Chen-Shien Chen, Yu-Chih Huang, Sheng-Yu Wu | 2018-01-16 |
| 9850126 | Integrated circuit package and method of forming same | Kuo Lung Pan, Chung-Shi Liu, Hao-Yi Tsai, Yu-Jen Cheng | 2017-12-26 |
| 9837346 | Packaging device having plural microstructures disposed proximate to die mounting region | Kuo Lung Pan, Chen-Shien Chen | 2017-12-05 |
| 9806042 | Strain reduced structure for IC packaging | Hsien-Wei Chen, Ying-Ju Chen, Tsung-Yuan Yu, Tsung-Ding Wang | 2017-10-31 |
| 9735130 | Chip packages and methods of manufacture thereof | Kuo Lung Pan, Ying-Jui Huang, Chen-Shien Chen | 2017-08-15 |
| 9691708 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hua Chen, Chih-Wei Lin, Hao-Yi Tsai, Yu-Jen Cheng +1 more | 2017-06-27 |
| 9673184 | Packages with molding material forming steps | Yu-Chen Hsu, Chun-Hung Lin, Han-Ping Pu | 2017-06-06 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Chih Huang, Kuo Lung Pan, Yu-Jen Cheng, Mirng-Ji Lii +2 more | 2017-05-30 |
| 9640521 | Multi-die package with bridge layer and method for making the same | Wei Sen Chang, Chen-Shien Chen, Mirng-Ji Lii | 2017-05-02 |
| 9633965 | Semiconductor structure and manufacturing method of the same | Yen-Liang Lin, Mirng-Ji Lii, Tin-Hao Kuo, Chen-Shien Chen, Sheng-Yu Wu | 2017-04-25 |
| 9607959 | Packaging device having plural microstructures disposed proximate to die mounting region | Kuo Lung Pan, Chen-Shien Chen | 2017-03-28 |
| 9589941 | Multi-chip package system and methods of forming the same | Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2017-03-07 |
| 9589861 | Semiconductor packaging having warpage control and methods of forming same | Yu-Chih Huang, Chun-Cheng Lin, Kuei-Wei Huang, Chen-Shien Chen | 2017-03-07 |
| 9576874 | Semiconductor devices and methods of manufacture thereof | Kai-Chiang Wu, Chun-Lin Lu, Hung-Jui Kuo | 2017-02-21 |