Issued Patents All Time
Showing 26–50 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707094 | Semiconductor package and manufacturing process thereof | Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2020-07-07 |
| 10698994 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Hao-Yi Tsai +2 more | 2020-06-30 |
| 10672489 | Electronic device with a fuse array mechanism | John E. Riley, Girish N. Cherussery, Scott E. Smith | 2020-06-02 |
| 10658334 | Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die | Yu-Jen Cheng, Yu-Chih Huang, Chih-Hua Chen, Hao-Yi Tsai | 2020-05-19 |
| 10643861 | Methods for making multi-die package with bridge layer | Wei Sen Chang, Chen-Shien Chen, Mirng-Ji Lii | 2020-05-05 |
| 10622031 | Power noise reduction technique for high density memory with gating | Harish N. Venkata | 2020-04-14 |
| 10553561 | Mechanisms of forming connectors for package on package | Chun-Hung Lin, Han-Ping Pu, Ming-Da Cheng, Kai-Chiang Wu | 2020-02-04 |
| 10509938 | Fingerprint sensor device and method | Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu | 2019-12-17 |
| 10504856 | Scheme for connector site spacing and resulting structures | Yen-Liang Lin, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2019-12-10 |
| 10497424 | Systems and methods for plate voltage regulation during memory array access | Byung S. Moon, Myung-Ho Bae, Harish N. Venkata | 2019-12-03 |
| 10418073 | Power noise reduction technique for high density memory with frequency adjustments | Harish N. Venkata | 2019-09-17 |
| 10403330 | Power noise reduction technique for high density memory with gating | Harish N. Venkata | 2019-09-03 |
| 10373698 | Electronic device with a fuse array mechanism | John E. Riley, Girish N. Cherussery, Scott E. Smith | 2019-08-06 |
| 10366971 | Pre-applying supporting materials between bonded package components | Yu-Chen Hsu, Han-Ping Pu, Meng-Tse Chen, Guan-Yu Chen | 2019-07-30 |
| 10360989 | Electronic device with a fuse-read trigger mechanism | Raghukiran Sreeramaneni, John E. Riley | 2019-07-23 |
| 10354114 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang | 2019-07-16 |
| 10332609 | Systems and methods for improving fuse systems in memory devices | John E. Riley, Scott E. Smith | 2019-06-25 |
| 10276402 | Semiconductor package and manufacturing process thereof | Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai +1 more | 2019-04-30 |
| 10268872 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Hao-Yi Tsai +2 more | 2019-04-23 |
| 10268868 | Fingerprint sensor device and method | Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu | 2019-04-23 |
| 10157274 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Hao-Yi Tsai +2 more | 2018-12-18 |
| 10157874 | Contact area design for solder bonding | Pei-Chun Tsai, Tin-Hao Kuo, Chen-Shien Chen, Yu-Chih Huang, Sheng-Yu Wu | 2018-12-18 |
| 10128208 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Hao-Cheng Hou, Jung Wei Cheng, Yu-Min Liang, Tsung-Ding Wang | 2018-11-13 |
| 10125014 | Integrated circuit package and method of forming same | Kuo Lung Pan, Chung-Shi Liu, Hao-Yi Tsai, Yu-Jen Cheng | 2018-11-13 |
| 10020276 | Protrusion bump pads for bond-on-trace processing | Chen-Shien Chen, Yu-Wei Lin, Tin-Hao Kuo, Yu-Min Liang, Chun-Hung Lin | 2018-07-10 |