Issued Patents All Time
Showing 101–105 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8970033 | Extending metal traces in bump-on-trace structures | Yuh Chern Shieh, Tsung-Shu Lin, Han-Ping Pu, Jiun Yi Wu, Tin-Hao Kuo | 2015-03-03 |
| 8680663 | Methods and apparatus for package on package devices with reduced strain | Han-Ping Pu | 2014-03-25 |
| 8373282 | Wafer level chip scale package with reduced stress on solder balls | Yu-Ling Tsai, Han-Ping Pu, Hung-Jui Kuo, Yu Yi Huang | 2013-02-12 |
| 8288871 | Reduced-stress bump-on-trace (BOT) structures | Yuh Chern Shieh, Han-Ping Pu, Tin-Hao Kuo | 2012-10-16 |
| 6312109 | Ink-jet head with bubble-driven flexible membrane | — | 2001-11-06 |