Issued Patents All Time
Showing 101–125 of 355 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515933 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Weng-Jin Wu, Chen-Hua Yu | 2019-12-24 |
| 10510641 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2019-12-17 |
| 10510561 | Semiconductor device package including conformal metal cap contacting each semiconductor die | Chen-Yu Tsai, Tsung-Shang Wei, Yu-Sheng Lin, Shin-Puu Jeng | 2019-12-17 |
| 10510699 | Bond structures and the methods of forming the same | Chen-Hua Yu, Ming-Fa Chen, Yi-Hsiu Chen | 2019-12-17 |
| 10510718 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh | 2019-12-17 |
| 10510604 | Semiconductor device and method | Chen-Hua Yu, Hung-Pin Chang, Yi-Hsiu Chen, Ku-Feng Yang | 2019-12-17 |
| 10497616 | Embedded 3D interposer structure | Ying-Ching Shih, Jing-Cheng Lin, Shin-Puu Jeng, Chen-Hua Yu | 2019-12-03 |
| 10396014 | Robust through-silicon-via structure | Yung-Chi Lin, Tsang-Jiuh Wu | 2019-08-27 |
| 10381254 | Wafer debonding and cleaning apparatus and method | Yu-Liang Lin, Hung-Jung Tu | 2019-08-13 |
| 10373885 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Sen Lu, Wen-Ching Tsai | 2019-08-06 |
| 10333623 | Optical transceiver | Yu-Kuang Liao, Cheng-Chun Tsai, Chen-Hua Yu, Fang Chen, Ping-Jung Wu | 2019-06-25 |
| 10319701 | Bonded 3D integrated circuit (3DIC) structure | Chen-Hua Yu, Chung-Shi Liu | 2019-06-11 |
| 10269761 | Semiconductor device and method | Cheng-Chun Tsai, Hung-Pin Chang, Ku-Feng Yang, Yi-Hsiu Chen | 2019-04-23 |
| 10269741 | Bond structures and the methods of forming the same | Chen-Hua Yu, Ming-Fa Chen, Yi-Hsiu Chen | 2019-04-23 |
| 10269717 | Structure and formation method for chip package | Chen-Hua Yu | 2019-04-23 |
| 10269611 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Ebin Liao | 2019-04-23 |
| 10170396 | Through via structure extending to metallization layer | Yi-Hsiu Chen, Ku-Feng Yang, Shin-Puu Jeng, Chen-Hua Yu | 2019-01-01 |
| 10163756 | Isolation structure for stacked dies | Hung-Pin Chang, Kuo-Ching Hsu, Chen-Shien Chen, Chen-Hua Yu | 2018-12-25 |
| 10163709 | Semiconductor device and method | Chen-Hua Yu, Hung-Pin Chang, Yi-Hsiu Chen, Ku-Feng Yang | 2018-12-25 |
| 10163706 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Jing-Cheng Lin, Shin-Puu Jeng | 2018-12-25 |
| 10163705 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2018-12-25 |
| 10157892 | Semiconductor packages and methods of forming the same | Ying-Ju Chen, Hsien-Wei Chen | 2018-12-18 |
| 10157866 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2018-12-18 |
| 10153338 | Method of manufacturing a capacitor | Chun Hua Chang, Der-Chyang Yeh, Kuang-Wei Cheng, Yuan-Hung Liu, Shang-Yun Hou +1 more | 2018-12-11 |
| 10153205 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Chen-Hua Yu, Shang-Yun Hou, Jui-Pin Hung, Der-Chyang Yeh, Chiung-Han Yeh | 2018-12-11 |