Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488842 | Method of making semiconductor device package including conformal metal cap contacting each semiconductor die | Chen-Yu Tsai, Yu-Sheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2022-11-01 |
| 10510561 | Semiconductor device package including conformal metal cap contacting each semiconductor die | Chen-Yu Tsai, Yu-Sheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2019-12-17 |