Issued Patents All Time
Showing 51–75 of 355 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545392 | Semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2023-01-03 |
| 11527439 | TSV structure and method forming same | Ming-Tsu Chung, Ku-Feng Yang, Tsang-Jiuh Wu, Chen-Hua Yu | 2022-12-13 |
| 11502072 | Integrated circuit package and method | Chen-Hua Yu, Yung-Chi Lin | 2022-11-15 |
| 11488842 | Method of making semiconductor device package including conformal metal cap contacting each semiconductor die | Chen-Yu Tsai, Tsung-Shang Wei, Yu-Sheng Lin, Shin-Puu Jeng | 2022-11-01 |
| 11487060 | Semiconductor device with nanostructures aligned with grating coupler and manufacturing method thereof | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Tsang-Jiuh Wu, Chen-Hua Yu | 2022-11-01 |
| 11469197 | Integrated circuit package and method | Chen-Hua Yu, Shih-Ting Lin, Szu-Wei Lu | 2022-10-11 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chen-Hua Yu, Chi-Hsi Wu, Tsang-Jiuh Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2022-10-11 |
| 11444020 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2022-09-13 |
| 11437344 | Wafer bonding method | Yung-Chi Lin, Tsang-Jiuh Wu, Chen-Hua Yu | 2022-09-06 |
| 11355475 | Singulation and bonding methods and structures formed thereby | Chen-Hua Yu, Tsang-Jiuh Wu | 2022-06-07 |
| 11304290 | Semiconductor structures and methods | Chen-Hua Yu, Yung-Chi Lin | 2022-04-12 |
| 11289450 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh | 2022-03-29 |
| 11264262 | Wafer debonding and cleaning apparatus | Yu-Liang Lin, Hung-Jung Tu | 2022-03-01 |
| 11239201 | 3D integrated circuit (3DIC) structure | Chen-Hua Yu, Chung-Shi Liu | 2022-02-01 |
| 11145623 | Integrated circuit packages and methods of forming the same | Chia-Hao Hsu, Yung-Chi Lin | 2021-10-12 |
| 11101240 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Yung-Chi Lin, Chen-Hua Yu | 2021-08-24 |
| 11063008 | Semiconductor structure and manufacturing method thereof | Yung-Chi Lin, Chen-Hua Yu, Tsang-Jiuh Wu | 2021-07-13 |
| 11056419 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2021-07-06 |
| 11043481 | Method of manufacturing semiconductor package structure | Yi-Hsiu Chen, Chen-Hua Yu, Ming-Fa Chen | 2021-06-22 |
| 11037904 | Singulation and bonding methods and structures formed thereby | Chen-Hua Yu, Tsang-Jiuh Wu | 2021-06-15 |
| 11004741 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2021-05-11 |
| 11004832 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Weng-Jin Wu, Chen-Hua Yu | 2021-05-11 |
| 10978424 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu | 2021-04-13 |
| 10971417 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Sen Lu, Wen-Ching Tsai | 2021-04-06 |
| 10914895 | Package structure and manufacturing method thereof | Yu-Kuang Liao, Cheng-Chun Tsai, Chen-Hua Yu, Fang Chen, Ping-Jung Wu | 2021-02-09 |