Issued Patents All Time
Showing 26–50 of 355 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2024-04-23 |
| 11961800 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Tsang-Jiuh Wu, Der-Chyang Yeh +1 more | 2024-04-16 |
| 11948920 | Semiconductor device and method for manufacturing the same, and semiconductor package | I-Chun Hsu, Yan-Zuo Tsai, Chia-Yin Chen, Yang-Chih Hsueh, Yung-Chi Lin +1 more | 2024-04-02 |
| 11869869 | Heterogeneous dielectric bonding scheme | Chen-Hua Yu, Ku-Feng Yang, Ming-Tsu Chung | 2024-01-09 |
| 11855067 | Integrated circuit package and method | Chen-Hua Yu, Yung-Chi Lin | 2023-12-26 |
| 11856800 | Semiconductor devices with system on chip devices | Chen-Hua Yu, Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2023-12-26 |
| 11855021 | Semiconductor structure with through substrate vias and manufacturing method thereof | Yung-Chi Lin, Chen-Hua Yu, Tsang-Jiuh Wu | 2023-12-26 |
| 11855042 | Method of manufacturing semiconductor structure | Ming-Fa Chen, Sung-Feng Yeh | 2023-12-26 |
| 11830861 | Semiconductor package | Yu-Kuang Liao, Cheng-Chun Tsai, Chen-Hua Yu, Fang Chen, Ping-Jung Wu | 2023-11-28 |
| 11823979 | Method of forming semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2023-11-21 |
| 11817410 | Integrated circuit package and method | Chen-Hua Yu, Shih-Ting Lin, Szu-Wei Lu | 2023-11-14 |
| 11817361 | Passivation structure with planar top surfaces | Yi-Hsiu Chen, Chen-Hua Yu | 2023-11-14 |
| 11774675 | Semiconductor device and manufacturing method thereof | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Tsang-Jiuh Wu, Chen-Hua Yu | 2023-10-03 |
| 11756883 | Through via structure and method | Yung-Chi Lin, Hsin-Yu Chen, Lin-Chih Huang, Tsang-Jiuh Wu | 2023-09-12 |
| 11728314 | Methods of forming integrated circuit packages | Chia-Hao Hsu, Yung-Chi Lin | 2023-08-15 |
| 11728296 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2023-08-15 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2023-08-15 |
| 11721666 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Yung-Chi Lin, Chen-Hua Yu | 2023-08-08 |
| 11699694 | Method of manufacturing semiconductor package structure | Yi-Hsiu Chen, Chen-Hua Yu, Ming-Fa Chen | 2023-07-11 |
| 11688639 | Semiconductor device and method | Chen-Hua Yu, Hung-Pin Chang, Yi-Hsiu Chen, Ku-Feng Yang | 2023-06-27 |
| 11610866 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu | 2023-03-21 |
| 11594571 | Stacked image sensor device and method of forming same | Chen-Hua Yu | 2023-02-28 |
| 11594420 | Semiconductor structure and manufacturing method thereof | Hung-Pin Chang, Tsang-Jiuh Wu | 2023-02-28 |
| 11585005 | Apparatus and method for wafer pre-wetting | Chen-Yu Tsai, Ku-Feng Yang | 2023-02-21 |
| 11585008 | Plating apparatus for plating semiconductor wafer and plating method | Chen-Yu Tsai, Ku-Feng Yang | 2023-02-21 |