Issued Patents All Time
Showing 426–450 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340155 | Semiconductor structure and method of forming | Wei-Yu Chen, Tien-Chung Yang, An-Jhih Su | 2019-07-02 |
| 10325864 | Guard ring method for semiconductor devices | Chung-Ying Yang | 2019-06-18 |
| 10325865 | Semiconductor structure and manufacturing method thereof | Ying-Ju Chen, Ming-Fa Chen | 2019-06-18 |
| 10319707 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chi-Hwang Tai | 2019-06-11 |
| 10319681 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-06-11 |
| 10312204 | System and method for an improved interconnect structure | Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu, Tsung-Yuan Yu | 2019-06-04 |
| 10312201 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen | 2019-06-04 |
| 10297471 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2019-05-21 |
| 10290584 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-05-14 |
| 10290571 | Packages with si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen | 2019-05-14 |
| 10283479 | Package structures and methods of forming the same | Li-Hsien Huang, An-Jhih Su | 2019-05-07 |
| 10283375 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2019-05-07 |
| 10276496 | Plurality of different size metal layers for a pad structure | Ching-Jung Yang, Chia-Wei Tu | 2019-04-30 |
| 10276549 | Package structure with dummy die | Li-Hsien Huang | 2019-04-30 |
| 10276542 | Package structure and manufacturing method thereof | Li-Hsien Huang, An-Jhih Su, Hua-Wei Tseng, Jo-Mei Wang, Tien-Chung Yang +1 more | 2019-04-30 |
| 10269489 | Programmable inductor | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hung-Yi Kuo, Nien-Fang Wu | 2019-04-23 |
| 10269767 | Multi-chip packages with multi-fan-out scheme and methods of manufacturing the same | Jie Chen | 2019-04-23 |
| 10269764 | Discrete polymer in fan-out packages | Jie Chen | 2019-04-23 |
| 10269752 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Li-Hsien Huang, Der-Chyang Yeh +2 more | 2019-04-23 |
| 10269750 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu | 2019-04-23 |
| 10269749 | Method of forming a semiconductor device with bump stop structure | Jie Chen | 2019-04-23 |
| 10269745 | Pad design for reliability enhancement in packages | — | 2019-04-23 |
| 10269739 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng, Wei-Yu Chen | 2019-04-23 |
| 10269738 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2019-04-23 |
| 10269723 | Alignment mark design for packages | Li-Hsien Huang, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2019-04-23 |