Issued Patents All Time
Showing 401–425 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510674 | Fan-out package having a main die and a dummy die, and method of forming | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu | 2019-12-17 |
| 10510654 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2019-12-17 |
| 10510556 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2019-12-17 |
| 10510715 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Tien-Chung Yang | 2019-12-17 |
| 10510629 | Integrated circuit package and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2019-12-17 |
| 10504751 | Package structures and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Lai Wei Chih | 2019-12-10 |
| 10504852 | Three-dimensional integrated circuit structures | Jie Chen, Ying-Ju Chen | 2019-12-10 |
| 10504873 | 3DIC structure with protective structure and method of fabricating the same and package | Ching-Jung Yang, Ming-Fa Chen | 2019-12-10 |
| 10504877 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2019-12-10 |
| 10497660 | Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices | — | 2019-12-03 |
| 10483174 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Chao-Hsiang Yang, Ming-Fa Chen | 2019-11-19 |
| 10475762 | 3DIC structure and method of manufacturing the same | Sung-Feng Yeh, Ming-Fa Chen | 2019-11-12 |
| 10475768 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2019-11-12 |
| 10475760 | Semiconductor device | Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2019-11-12 |
| 10468379 | 3DIC structure and method of manufacturing the same | Tzuan-Horng Liu, Jiun-Heng Wang, Ming-Fa Chen | 2019-11-05 |
| 10461060 | Structure and formation method of chip package with redistribution layers | Jie Chen | 2019-10-29 |
| 10453815 | Methods and apparatus for solder connections | Chen-Hua Yu, Hao-Yi Tsai, Chien-Hsiun Lee, Chung-Shi Liu | 2019-10-22 |
| 10381298 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen | 2019-08-13 |
| 10366959 | Integrated fan-out structure and method of forming | An-Jhih Su, Tsung-Shu Lin | 2019-07-30 |
| 10366953 | Redistribution layer structures for integrated circuit package | Jie Chen, Chen-Hua Yu, Der-Chyang Yeh, Ying-Ju Chen | 2019-07-30 |
| 10354986 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2019-07-16 |
| 10354961 | Routing design of dummy metal cap and redistribution line | Chen-Hua Yu, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2019-07-16 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2019-07-09 |
| 10347572 | Molding compound structure | — | 2019-07-09 |
| 10340240 | Mechanisms for forming post-passivation interconnect structure | Ying-Ju Chen | 2019-07-02 |