Issued Patents All Time
Showing 376–400 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643965 | Structure and method of forming a joint assembly | Ying-Ju Chen, An-Jhih Su, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2020-05-05 |
| 10643864 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2020-05-05 |
| 10629560 | Semiconductor structure | Jie Chen, Ying-Ju Chen | 2020-04-21 |
| 10629555 | Packaging devices and methods of manufacture thereof | Jie Chen | 2020-04-21 |
| 10629537 | Conductive vias in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2020-04-21 |
| 10629476 | Packages with through-vias having tapered ends | — | 2020-04-21 |
| 10546838 | Integrated circuit package assembly | — | 2020-01-28 |
| 10541226 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su +1 more | 2020-01-21 |
| 10535537 | Packaged semiconductor devices and methods of packaging semiconductor devices | — | 2020-01-14 |
| 10522481 | Post-passivation interconnect structure | Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2019-12-31 |
| 10522490 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Jie Chen | 2019-12-31 |
| 10522473 | Alignment mark design for packages | Li-Hsien Huang, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2019-12-31 |
| 10522477 | Method of making package assembly including stress relief structures | — | 2019-12-31 |
| 10522480 | Packaging devices and methods of manufacture thereof | Tsung-Yuan Yu, Ming-Da Cheng, Wen-Hsiung Lu | 2019-12-31 |
| 10515922 | Multi-chip integrated fan-out package | Jie Chen | 2019-12-24 |
| 10515865 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2019-12-24 |
| 10515874 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Ming-Fa Chen | 2019-12-24 |
| 10515915 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng, Wei-Yu Chen | 2019-12-24 |
| 10510670 | Pad structure design in fan-out package | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh | 2019-12-17 |
| 10510674 | Fan-out package having a main die and a dummy die, and method of forming | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu | 2019-12-17 |
| 10510668 | Method of fabricating semiconductor device | Jie Chen | 2019-12-17 |
| 10510678 | Eliminate sawing-induced peeling through forming trenches | Jie Chen | 2019-12-17 |
| 10510635 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2019-12-17 |
| 10510650 | Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2019-12-17 |
| 10510654 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2019-12-17 |