Issued Patents All Time
Showing 351–375 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727211 | Package structure with dummy die | Li-Hsien Huang | 2020-07-28 |
| 10727082 | Semiconductor device and manufacturing method thereof | Shou-Zen Chang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen +3 more | 2020-07-28 |
| 10720409 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Li-Hsien Huang, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-07-21 |
| 10720385 | Semiconductor structure | Ying-Ju Chen | 2020-07-21 |
| 10714442 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Ming-Da Cheng, Chung-Shi Liu | 2020-07-14 |
| 10714426 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2020-07-14 |
| 10700045 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu | 2020-06-30 |
| 10700040 | Discrete polymer in fan-out packages | Jie Chen | 2020-06-30 |
| 10700026 | Package with UBM and methods of forming | Li-Hsien Huang | 2020-06-30 |
| 10685937 | Integrated circuit package having dummy structures and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2020-06-16 |
| 10685935 | Forming metal bonds with recesses | Ming-Fa Chen, Sung-Feng Yeh, Wen-Chih Chiou | 2020-06-16 |
| 10685910 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen | 2020-06-16 |
| 10679953 | Integrated fan-out structure and method of forming | An-Jhih Su, Tsung-Shu Lin | 2020-06-09 |
| 10672754 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chi-Hwang Tai | 2020-06-02 |
| 10672741 | Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Li-Hsien Huang, Yueh-Ting Lin, Wei-Yu Chen +1 more | 2020-06-02 |
| 10672738 | Package structures and methods of forming | Chen-Hua Yu, Der-Chyang Yeh | 2020-06-02 |
| 10672734 | Package structures and methods of forming the same | Li-Hsien Huang, An-Jhih Su | 2020-06-02 |
| 10672674 | Method of forming semiconductor device package having testing pads on a topmost die | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hui Liu, Ching-Pin Yuan | 2020-06-02 |
| 10665572 | Semiconductor package and manufacturing method thereof | Jie Chen | 2020-05-26 |
| 10665540 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Der-Chyang Yeh, Chen-Hua Yu | 2020-05-26 |
| 10658339 | Semiconductor device and method of manufacture | Ying-Ju Chen, An-Jhih Su, Jie Chen | 2020-05-19 |
| 10658337 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, An-Jhih Su | 2020-05-19 |
| 10658333 | Package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh | 2020-05-19 |
| 10658290 | Plurality of different size metal layers for a pad structure | Ching-Jung Yang, Chia-Wei Tu | 2020-05-19 |
| 10651131 | Supporting InFO packages to reduce warpage | Jie Chen, Ying-Ju Chen | 2020-05-12 |