Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043482 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh | 2021-06-22 |
| 10672754 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh | 2020-06-02 |
| 10319707 | Semiconductor component, package structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh | 2019-06-11 |