Issued Patents All Time
Showing 301–325 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950579 | Integrated circuit package and method of forming same | Ming-Fa Chen, Chen-Hua Yu | 2021-03-16 |
| 10950577 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2021-03-16 |
| 10950576 | Package structure | Tzuan-Horng Liu, Jiun-Heng Wang, Ming-Fa Chen | 2021-03-16 |
| 10950575 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su +1 more | 2021-03-16 |
| 10943889 | Semiconductor device and method of manufacture | Ying-Ju Chen, An-Jhih Su, Jie Chen | 2021-03-09 |
| 10943798 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2021-03-09 |
| 10939551 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2021-03-02 |
| 10937743 | Mixing organic materials into hybrid packages | Ming-Fa Chen, Chih-Chia Hu, Chen-Hua Yu | 2021-03-02 |
| 10930633 | Buffer design for package integration | Jie Chen, Ming-Fa Chen, Chen-Hua Yu | 2021-02-23 |
| 10930580 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Ming-Fa Chen | 2021-02-23 |
| 10923421 | Package structure and method of manufacturing the same | Ying-Ju Chen, Ming-Fa Chen | 2021-02-16 |
| 10886245 | Semiconductor structure, 3DIC structure and method of fabricating the same | Jie Chen, Ming-Fa Chen, Sung-Feng Yeh | 2021-01-05 |
| 10886238 | Supporting InFO packages to reduce warpage | Jie Chen, Ying-Ju Chen | 2021-01-05 |
| 10879138 | Semiconductor packaging structure including interconnection to probe pad with probe mark and method of manufacturing the same | Ching-Jung Yang, Jie Chen | 2020-12-29 |
| 10879198 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2020-12-29 |
| 10872865 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Jie Chen | 2020-12-22 |
| 10867966 | Package structure, package-on-package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2020-12-15 |
| 10867967 | Chip package with redistribution layers | Jie Chen | 2020-12-15 |
| 10867900 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2020-12-15 |
| 10867968 | 3DIC structure with protective structure and method of fabricating the same | Ching-Jung Yang, Ming-Fa Chen | 2020-12-15 |
| 10867879 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2020-12-15 |
| 10867896 | Molding compound structure | — | 2020-12-15 |
| 10861808 | Bonding structure of dies with dangling bonds | Ming-Fa Chen, Chih-Chia Hu | 2020-12-08 |
| 10854565 | Chip package structure with bump | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2020-12-01 |
| 10854574 | Forming metal bonds with recesses | Ming-Fa Chen, Sung-Feng Yeh, Wen-Chih Chiou | 2020-12-01 |