Issued Patents All Time
Showing 326–350 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847383 | Stacked semiconductor devices and methods of forming same | Der-Chyang Yeh, Li-Hsien Huang | 2020-11-24 |
| 10840190 | Semiconductor structure and manufacturing method thereof | Ching-Jung Yang, Ming-Fa Chen | 2020-11-17 |
| 10840199 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Ming-Da Cheng, Wei-Yu Chen | 2020-11-17 |
| 10833031 | Pad design for reliability enhancement in packages | — | 2020-11-10 |
| 10833030 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Chen-Hua Yu, Tsung-Shu Lin, Wei-Cheng Wu | 2020-11-10 |
| 10825804 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2020-11-03 |
| 10825780 | Semiconductor device with electromagnetic interference protection and method of manufacture | Chi-Hsi Wu, Li-Hsien Huang, Tien-Chung Yang | 2020-11-03 |
| 10818624 | Semiconductor structure and method for manufacturing the same | Ming-Fa Chen | 2020-10-27 |
| 10818615 | Semiconductor structure | Ying-Ju Chen, Ming-Fa Chen | 2020-10-27 |
| 10811394 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2020-10-20 |
| 10811390 | Die stack structure and method of fabricating the same and package | Jie Chen, Ming-Fa Chen | 2020-10-20 |
| 10811389 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2020-10-20 |
| 10811369 | Packaging devices and methods of manufacture thereof | Tsung-Yuan Yu, Ming-Da Cheng, Wen-Hsiung Lu | 2020-10-20 |
| 10797015 | Method of manufacturing 3DIC structure | Sung-Feng Yeh, Ming-Fa Chen | 2020-10-06 |
| 10797001 | Three-dimensional integrated circuit structures | Jie Chen, Ying-Ju Chen | 2020-10-06 |
| 10796927 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2020-10-06 |
| 10784247 | Process control for package formation | Ming-Fa Chen | 2020-09-22 |
| 10770366 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Tsung-Fu Tsai, Wen-Hsiung Lu, Yian-Liang Kuo | 2020-09-08 |
| 10756010 | Semiconductor device packaging structure having through interposer vias and through substrate vias | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Tzuan-Horng Liu | 2020-08-25 |
| 10756007 | Pad design for reliability enhancement in packages | Jie Chen | 2020-08-25 |
| 10741512 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Jie Chen | 2020-08-11 |
| 10741506 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Ming-Fa Chen | 2020-08-11 |
| 10741490 | Device and package structure | An-Jhih Su, Li-Hsien Huang | 2020-08-11 |
| 10734357 | Chip package structure with molding layer | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2020-08-04 |
| 10732679 | Portable information handling system low height mono barrel hinge | Chin-Chung Wu, Chih-Ping Chang, Te-Sen Chin, An-Chung Hsieh, Jihun Yeom +1 more | 2020-08-04 |