Issued Patents All Time
Showing 451–475 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269693 | Packaged semiconductor devices and methods of packaging thereof | — | 2019-04-23 |
| 10262952 | Ring structures in device die | Ying-Ju Chen, Jie Chen | 2019-04-16 |
| 10262964 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Ming-Da Cheng, Chung-Shi Liu | 2019-04-16 |
| 10262958 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2019-04-16 |
| 10217687 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, An-Jhih Su, Li-Hsien Huang | 2019-02-26 |
| 10204863 | Semiconductor package structure | Jie Chen | 2019-02-12 |
| 10204883 | Semiconductor device and manufacturing method thereof | Jie Chen | 2019-02-12 |
| 10181449 | Semiconductor structure | Jie Chen, Ying-Ju Chen | 2019-01-15 |
| 10177115 | Package structures and methods of forming | Chen-Hua Yu, Der-Chyang Yeh | 2019-01-08 |
| 10177032 | Devices, packaging devices, and methods of packaging semiconductor devices | An-Jhih Su, Jo-Mei Wang | 2019-01-08 |
| 10163701 | Multi-stack package-on-package structures | Chi-Jung Lee, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang, Li-Hsien Huang | 2018-12-25 |
| 10165682 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2018-12-25 |
| 10163866 | Semiconductor device and method of manufacture | Ying-Ju Chen, An-Jhih Su, Jie Chen | 2018-12-25 |
| 10163865 | Integrated circuit package assembly | — | 2018-12-25 |
| 10163862 | Package structure and method for forming same | Kuo-Chuan Liu | 2018-12-25 |
| 10163861 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2018-12-25 |
| 10163807 | Alignment pattern for package singulation | Ying-Ju Chen, Der-Chyang Yeh, Shih-Peng Tai | 2018-12-25 |
| 10163805 | Package structure and method for forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh, Chi-Hsi Wu | 2018-12-25 |
| 10163802 | Fan-out package having a main die and a dummy die, and method of forming | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu | 2018-12-25 |
| 10163661 | Stacked semiconductor devices and methods of forming same | Der-Chyang Yeh, Li-Hsien Huang | 2018-12-25 |
| 10163800 | Package structure with dummy feature in passivation layer | Jie Chen | 2018-12-25 |
| 10157867 | Interconnect structure and method | Ying-Ju Chen, Chen-Hua Yu, Ming-Fa Chen, Chih-Chia Hu | 2018-12-18 |
| 10157892 | Semiconductor packages and methods of forming the same | Ying-Ju Chen, Wen-Chih Chiou | 2018-12-18 |
| 10157825 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Li-Han Hsu +1 more | 2018-12-18 |
| 10157854 | Eliminate sawing-induced peeling through forming trenches | Jie Chen | 2018-12-18 |