Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080592 | Film stack simplification for high aspect ratio patterning and vertical scaling | Hui-Jung Wu, Bart J. van Schravendijk, Mark Kawaguchi, Gereng Gunawan, Jay E. Uglow +11 more | 2024-09-03 |
| 11832533 | Conformal damage-free encapsulation of chalcogenide materials | James S. Sims, Andrew John McKerrow, Thorsten Lill, Shane Tang, Kathryn M. Kelchner +4 more | 2023-11-28 |
| 11792987 | Self-aligned vertical integration of three-terminal memory devices | Thorsten Lill, John Hoang, Hui-Jung Wu, Gereng Gunawan, Yang Pan | 2023-10-17 |
| 11488812 | Method and apparatus for reducing particle defects in plasma etch chambers | Xikun Wang, Andrew Nguyen, Changhun Lee, Xiaoming He | 2022-11-01 |
| 11239420 | Conformal damage-free encapsulation of chalcogenide materials | James S. Sims, Andrew John McKerrow, Thorsten Lill, Shane Tang, Kathryn M. Kelchner +4 more | 2022-02-01 |
| 10784086 | Cobalt etch back | Jialing Yang, Baosuo Zhou, Thorsten Lill, John Hoang | 2020-09-22 |
| 10658161 | Method and apparatus for reducing particle defects in plasma etch chambers | Xikun Wang, Andrew Nguyen, Changhun Lee, Xiaoming He | 2020-05-19 |
| 10304659 | Ale smoothness: in and outside semiconductor industry | Keren Jacobs Kanarik, Samantha Tan, Thorsten Lill, Yang Pan, Jeffrey Marks +1 more | 2019-05-28 |
| 10199235 | Liner and barrier applications for subtractive metal integration | Hui-Jung Wu, Thomas Knisley, Nagraj Shankar, John Hoang, Prithu Sharma | 2019-02-05 |
| 10096487 | Atomic layer etching of tungsten and other metals | Wenbing Yang, Samantha Tan, Keren Jacobs Kanarik, Jeffrey Marks, Taeseung Kim +1 more | 2018-10-09 |
| 9984858 | ALE smoothness: in and outside semiconductor industry | Keren Jacobs Kanarik, Samantha Tan, Thorsten Lill, Yang Pan, Jeffrey Marks +1 more | 2018-05-29 |
| 9953843 | Chamber for patterning non-volatile metals | Shuogang Huang, Thorsten Lill, Theo Panagopoulos | 2018-04-24 |
| 9899234 | Liner and barrier applications for subtractive metal integration | Hui-Jung Wu, Thomas Knisley, Nagraj Shankar, John Hoang, Prithu Sharma | 2018-02-20 |
| 9870899 | Cobalt etch back | Jialing Yang, Baosuo Zhou, Thorsten Lill, John Hoang | 2018-01-16 |
| 9818633 | Equipment front end module for transferring wafers and method of transferring wafers | Thorsten Lill, Vahid Vahedi, Candi Kristoffersen, Andrew D. Bailey, III, Rangesh Raghavan +1 more | 2017-11-14 |
| 9595452 | Residue free oxide etch | Chih-Hsun Hsu, Thorsten Lill | 2017-03-14 |
| 9589853 | Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber | Monica Titus, Gowri Kamarthy, Harmeet Singh, Yoshie Kimura, Baosuo Zhou +2 more | 2017-03-07 |
| 9570320 | Method to etch copper barrier film | Ji Zhu, Shuogang Huang, Baosuo Zhou, John Hoang, Prithu Sharma +1 more | 2017-02-14 |
| 9533332 | Methods for in-situ chamber clean utilized in an etching processing chamber | Noel Sun, Nicolas Gani, Chung Liu, Radhika Mani | 2017-01-03 |
| 9431268 | Isotropic atomic layer etch for silicon and germanium oxides | Thorsten Lill, Ivan L. Berry, III, Alan M. Schoepp, David Hemker | 2016-08-30 |
| 9391267 | Method to etch non-volatile metal materials | Harmeet Singh, Samantha Tan, Jeffrey Marks, Thorsten Lill, Richard Janek +2 more | 2016-07-12 |
| 9257638 | Method to etch non-volatile metal materials | Samantha Tan, Wenbing Yang, Richard Janek, Jeffrey Marks, Harmeet Singh +1 more | 2016-02-09 |
| 9130158 | Method to etch non-volatile metal materials | Harmeet Singh, Samantha Tan, Jeffrey Marks, Thorsten Lill, Richard Janek +2 more | 2015-09-08 |
| 8722547 | Etching high K dielectrics with high selectivity to oxide containing layers at elevated temperatures with BC13 based etch chemistries | Radhika Mani, Nicolas Gani, Wei Liu, Shashank Deshmukh | 2014-05-13 |
| 8501626 | Methods for high temperature etching a high-K material gate structure | Wei Liu, Eiichi Matsusue, Shashank Deshmukh, Anh Phan, David Palagashvili +4 more | 2013-08-06 |