Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237216 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, Shihsheng Chang, Ying Trickett, Eric Chih-Fang Liu, Yun Han +5 more | 2025-02-25 |
| 11700778 | Method for controlling the forming voltage in resistive random access memory devices | Steven P. Consiglio, Kandabara Tapily, Takaaki Tsunomura, Takashi Ando, Paul C. Jamison +3 more | 2023-07-11 |
| 11621190 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark +3 more | 2023-04-04 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark +3 more | 2021-06-01 |
| 10991881 | Method for controlling the forming voltage in resistive random access memory devices | Steven P. Consiglio, Kandabara Tapily, Takaaki Tsunomura, Takashi Ando, Paul C. Jamison +3 more | 2021-04-27 |
| 10950460 | Method utilizing using post etch pattern encapsulation | Angelique Raley, Andrew Metz, Junling Sun | 2021-03-16 |
| 10700009 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Nicholas Joy, Eric Chih-Fang Liu, David L. O'Meara, David S. H. Rosenthal +2 more | 2020-06-30 |
| 10157784 | Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization | Kai-Hung Yu, Manabu Oie, Kaoru Maekawa, Gerrit J. Leusink, Yuuki Kikuchi +2 more | 2018-12-18 |
| 10068764 | Selective metal oxide deposition using a self-assembled monolayer surface pretreatment | Kandabara Tapily, Gerrit J. Leusink, Hoyoung Kang | 2018-09-04 |
| 10056328 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Gerrit J. Leusink, Tadahiro Ishizaka, Takahiro Hakamata | 2018-08-21 |
| 10008564 | Method of corner rounding and trimming of nanowires by microwave plasma | Kandabara Tapily, Ying Trickett, Chihiro TAMURA, Gerrit J. Leusink, Kaoru Maekawa | 2018-06-26 |
| 9711449 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Gerrit J. Leusink, Tadahiro Ishizaka, Takahiro Hakamata | 2017-07-18 |
| 9607888 | Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling | Kai-Hung Yu, Toshio Hasegawa, Tadahiro Ishizaka, Manabu Oie, Fumitaka Amano +3 more | 2017-03-28 |
| 8722548 | Structures and techniques for atomic layer deposition | Shintaro Aoyama, Robert D. Clark, Steven P. Consiglio, Marinus Hopstaken, Hemanth Jagannathan +4 more | 2014-05-13 |
| 8460945 | Method for monitoring status of system components | David L. O'Meara, Daniel Craig Burdett, Stephen Cabral, Gert Leusink, John William Kostenko | 2013-06-11 |
| 7964515 | Method of forming high-dielectric constant films for semiconductor devices | Robert D. Clark | 2011-06-21 |
| 7517814 | Method and system for forming an oxynitride layer by performing oxidation and nitridation concurrently | Kristen Scheer, Toshihara Furakawa | 2009-04-14 |
| 7501352 | Method and system for forming an oxynitride layer | Masanobu Igeta, David L. O'Meara, Kristen Scheer, Toshihara Eurakawa | 2009-03-10 |
| 7479454 | Method and processing system for monitoring status of system components | David L. O'Meara, Daniel Craig Burdett, Stephen Cabral, Gert Leusink, John William Kostenko | 2009-01-20 |
| 7470591 | Method of forming a gate stack containing a gate dielectric layer having reduced metal content | David L. O'Meara, Youngjong Lee | 2008-12-30 |
| 7419702 | Method for processing a substrate | Kazuhito Nakamura, Enrico Mosca, Yumiko Kawano, Gert Leusink, Fenton R. McFeely +1 more | 2008-09-02 |
| 7393761 | Method for fabricating a semiconductor device | Gert Leusink | 2008-07-01 |
| 7300891 | Method and system for increasing tensile stress in a thin film using multi-frequency electromagnetic radiation | Igeta Masonobu, Gert Leusink | 2007-11-27 |
| 7235440 | Formation of ultra-thin oxide layers by self-limiting interfacial oxidation | David L. O'Meara, Anthony Dip, Michael Toeller, Toshihara Furukawa, Kristen Scheer +6 more | 2007-06-26 |
| 7202186 | Method of forming uniform ultra-thin oxynitride layers | David L. O'Meara, Anthony Dip, Michael Toeller, Toshihara Furukawa, Kristen Scheer +6 more | 2007-04-10 |