Issued Patents All Time
Showing 201–225 of 635 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734523 | Nanosheet substrate to source/drain isolation | Fee Li Lie, Mona A. Ebrish, Ekmini Anuja De Silva, Indira Seshadri, Gauri Karve +2 more | 2020-08-04 |
| 10734475 | Stacked MIM capacitors with self-aligned contact to reduce via enclosure | Takashi Ando, Robert A. Groves, Hemanth Jagannathan, Griselda Bonilla | 2020-08-04 |
| 10734289 | Method for forming strained fin channel devices | Kangguo Cheng, Junli Wang, Carl Radens, John H. Zhang | 2020-08-04 |
| 10734277 | Top via back end of the line interconnect integration | Chih-Chao Yang, Benjamin D. Briggs, Brent A. Anderson | 2020-08-04 |
| 10727124 | Structure and method for forming fully-aligned trench with an up-via integration scheme | Nicholas Anthony Lanzillo, Benjamin D. Briggs | 2020-07-28 |
| 10720567 | Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield | Benjamin D. Briggs, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert | 2020-07-21 |
| 10714389 | Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration | Hsueh-Chung Chen, James J. Kelly, Yann Mignot, Cornelius Brown Peethala | 2020-07-14 |
| 10700214 | Overturned thin film device with self-aligned gate and source/drain (S/D) contacts | Carl Radens, Yiheng Xu, John H. Zhang | 2020-06-30 |
| 10699950 | Method of optimizing wire RC for device performance and reliability | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Terry A. Spooner | 2020-06-30 |
| 10699050 | Front-end-of-line shape merging cell placement and optimization | David Wolpert, Erwin Behnen, Patrick Watson, Chih-Chao Yang, Timothy A. Schell | 2020-06-30 |
| 10681207 | Caller identity verification based on unique multi-device signatures | Richard C. Johnson, Spyridon Skordas | 2020-06-09 |
| 10679934 | Capacitance reduction in sea of lines BEOL metallization | Benjamin D. Briggs, Huai Huang, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha | 2020-06-09 |
| 10676216 | Non-intrusive unmanned entity inspection | Yuk L. Chan, Eileen P. Tedesco, Kyle E. Gilbertson, Daniel F. Hogerty, Benjamin D. Briggs | 2020-06-09 |
| 10672984 | Resistive memory crossbar array compatible with Cu metallization | Takashi Ando, Michael Rizzolo, Shyng-Tsong Chen | 2020-06-02 |
| 10658585 | Dedicated contacts for controlled electroforming of memory cells in resistive random-access memory array | Takashi Ando, Chih-Chao Yang, Benjamin D. Briggs | 2020-05-19 |
| 10658235 | Rework for metal interconnects using etch and thermal anneal | Prasad Bhosale, Terry A. Spooner, Chih-Chao Yang | 2020-05-19 |
| 10658233 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Koichi Motoyama, Benjamin D. Briggs, Gangadhara Raja Muthinti, Cornelius Brown Peethala | 2020-05-19 |
| 10657677 | Cognitive situation-aware vision deficiency remediation | Yuk L. Chan, Alain Loiseau, Deepti M. Naphade | 2020-05-19 |
| 10651078 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Michael Rizzolo, Hosadurga Shobha | 2020-05-12 |
| 10636738 | Contacts having a geometry to reduce resistance | Baozhen Li, Kirk D. Peterson, Terry A. Spooner, Junli Wang | 2020-04-28 |
| 10629529 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2020-04-21 |
| 10629478 | Dual-damascene formation with dielectric spacer and thin liner | Benjamin D. Briggs, Huai Huang, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha | 2020-04-21 |
| 10629009 | Non-intrusive unmanned entity inspection | Yuk L. Chan, Eileen P. Tedesco, Kyle E. Gilbertson, Daniel F. Hogerty, Benjamin D. Briggs | 2020-04-21 |
| 10622250 | Dielectric gap fill evaluation for integrated circuits | Isabel Cristina Chu, Leigh Anne H. Clevenger, Ekmini Anuja De Silva, Gauri Karve, Fee Li Lie +3 more | 2020-04-14 |
| 10615119 | Back end of line electrical fuse structure and method of fabrication | Benjamin D. Briggs, Michael Rizzolo, Chih-Chao Yang | 2020-04-07 |