Issued Patents All Time
Showing 226–250 of 635 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10615116 | Surface nitridation in metal interconnects | Roger A. Quon, Terry A. Spooner, Wei Wang, Chih-Chao Yang | 2020-04-07 |
| 10614918 | Authentication of medication delivery vehicle to facilitate medication release | Ira L. Allen, Gregory J. Boss, Andrew R. Jones, Kevin C. McConnell, John E. Moore, Jr. | 2020-04-07 |
| 10606231 | Computer-mediated reality including physical damping feedback | Benjamin D. Briggs, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins | 2020-03-31 |
| 10600638 | Nanosheet transistors with sharp junctions | Kangguo Cheng, Balasubramanian S. Pranatharthi Haran, John H. Zhang | 2020-03-24 |
| 10593506 | Fold over emitter and collector field emission transistor | Benjamin D. Briggs, Michael Rizzolo | 2020-03-17 |
| 10586767 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Koichi Motoyama, Gen Tsutsui +2 more | 2020-03-10 |
| 10586741 | Gate height and spacer uniformity | Kangguo Cheng, Balasubramanian S. Pranatharthi Haran, John H. Zhang | 2020-03-10 |
| 10586012 | Semiconductor process modeling to enable skip via in place and route flow | Dongbing Shao, Zheng Xu | 2020-03-10 |
| 10580740 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Chao-Kun Hu, Takeshi Nogami, Deepika Priyadarshini, Michael Rizzolo | 2020-03-03 |
| 10580738 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2020-03-03 |
| 10580435 | Sentiment analysis of mental health disorder symptoms | Maryam Ashoori, Benjamin D. Briggs, Leigh Anne H. Clevenger | 2020-03-03 |
| 10573520 | Multiple patterning scheme integration with planarized cut patterning | Hsueh-Chung Chen, Yongan Xu, Yann Mignot, Cornelius Brown Peethala | 2020-02-25 |
| 10565872 | Cognitive situation-aware vision deficiency remediation | Yuk L. Chan, Alain Loiseau, Deepti M. Naphade | 2020-02-18 |
| 10559498 | Location-specific laser annealing to improve interconnect microstructure | Benjamin D. Briggs, Bartlet H. DeProspo, Michael Rizzolo | 2020-02-11 |
| 10553789 | Fully aligned semiconductor device with a skip-level via | Nicholas Anthony Lanzillo, Benjamin D. Briggs, Chih-Chao Yang, Hsueh-Chung Chen | 2020-02-04 |
| 10546892 | Resistive memory device with meshed electrodes | Takashi Ando, Chih-Chao Yang, Michael Rizzolo | 2020-01-28 |
| 10546774 | Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs | Sean D. Burns, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more | 2020-01-28 |
| 10546743 | Advanced interconnect with air gap | John H. Zhang, Yann Mignot, Carl Radens, Richard S. Wise, Yiheng Xu +2 more | 2020-01-28 |
| 10545806 | Proximity correction in three-dimensional manufacturing | Benjamin D. Briggs, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins | 2020-01-28 |
| 10541206 | Interconnect structure including air gaps enclosed between conductive lines and a permeable dielectric layer | Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo | 2020-01-21 |
| 10535608 | Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate | Joshua M. Rubin, Charles L. Arvin | 2020-01-14 |
| 10529569 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2020-01-07 |
| 10529662 | Method and structure to construct cylindrical interconnects to reduce resistance | Benjamin D. Briggs, Michael Rizzolo, Christopher J. Penny, Huai Huang, Hosadurga Shobha | 2020-01-07 |
| 10515894 | Enhanced self-alignment of vias for a semiconductor device | Benjamin D. Briggs, Bartlet H. DeProspo, Michael Rizzolo, Nicole Saulnier | 2019-12-24 |
| 10515903 | Selective CVD alignment-mark topography assist for non-volatile memory | Michael Rizzolo, Chih-Chao Yang, Benjamin D. Briggs | 2019-12-24 |