Issued Patents All Time
Showing 276–300 of 635 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10377304 | Cognitive situation-aware vision deficiency remediation | Yuk L. Chan, Alain Loiseau, Deepti M. Naphade | 2019-08-13 |
| 10381338 | Metal fill optimization for self-aligned double patterning | Albert M. Chu, Ximeng Guan, Myung-Hee Na | 2019-08-13 |
| 10381348 | Structure and method for equal substrate to channel height between N and P fin-FETs | Leigh Anne H. Clevenger, Mona A. Ebrish, Gauri Karve, Fee Li Lie, Deepika Priyadarshini +2 more | 2019-08-13 |
| 10381561 | Dedicated contacts for controlled electroforming of memory cells in resistive random-access memory array | Takashi Ando, Chih-Chao Yang, Benjamin D. Briggs | 2019-08-13 |
| 10381563 | Resistive memory crossbar array compatible with Cu metallization | Takashi Ando, Michael Rizzolo, Shyng-Tsong Chen | 2019-08-13 |
| 10376444 | Secure medication delivery | Ira L. Allen, Gregory J. Boss, Andrew R. Jones, Kevin C. McConnell, John E. Moore, Jr. | 2019-08-13 |
| 10366952 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2019-07-30 |
| 10366920 | Location-specific laser annealing to improve interconnect microstructure | Benjamin D. Briggs, Bartlet H. DeProspo, Michael Rizzolo | 2019-07-30 |
| 10361265 | Precision BEOL resistors | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Junli Wang, Chih-Chao Yang | 2019-07-23 |
| 10361157 | Method of manufacturing self-aligned interconnects by deposition of a non-conformal air-gap forming layer having an undulated upper surface | Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo | 2019-07-23 |
| 10361364 | Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size | Liying Jiang, Sebastian Naczas, Michael Rizzolo, Chih-Chao Yang | 2019-07-23 |
| 10361079 | Multi-angled deposition and masking for custom spacer trim and selected spacer removal | Marc A. Bergendahl, Sean D. Burns, Christopher J. Penny, Michael Rizzolo | 2019-07-23 |
| 10361153 | Surface nitridation in metal interconnects | Roger A. Quon, Terry A. Spooner, Wei Wang, Chih-Chao Yang | 2019-07-23 |
| 10361117 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Michael Rizzolo, Hosadurga Shobha | 2019-07-23 |
| 10354921 | Stacked transistors with different channel widths | Kangguo Cheng, Balasubramanian Pranatharthiharan, John H. Zhang | 2019-07-16 |
| 10347617 | Self-aligned three dimensional chip stack and method for making the same | Carl Radens, Yiheng Xu, John H. Zhang | 2019-07-09 |
| 10340330 | Precision BEOL resistors | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Junli Wang, Chih-Chao Yang | 2019-07-02 |
| 10332956 | Precision beol resistors | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Junli Wang, Chih-Chao Yang | 2019-06-25 |
| 10332955 | Precision BEOL resistors | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Junli Wang, Chih-Chao Yang | 2019-06-25 |
| 10325778 | Utilizing multiple layers to increase spatial frequency | John H. Zhang, Carl Radens | 2019-06-18 |
| 10325777 | Utilizing multiple layers to increase spatial frequency | John H. Zhang, Carl Radens | 2019-06-18 |
| 10319870 | Photovoltaic module with a controllable infrared protection layer | Timothy J. Dalton, Maxime Darnon, Rainer Krause, Gerd Pfeiffer, Kevin M. Prettyman +2 more | 2019-06-11 |
| 10319630 | Encapsulated damascene interconnect structure for integrated circuits | John H. Zhang, Carl Radens, Yiheng Xu | 2019-06-11 |
| 10319629 | Skip via for metal interconnects | Chih-Chao Yang, Brent A. Anderson, Nicholas Anthony Lanzillo | 2019-06-11 |
| 10315451 | Structure, system, method, and recording medium of implementing a directed self-assembled security pattern | Benjamin D. Briggs, Bartlet H. DeProspo, Michael Rizzolo | 2019-06-11 |