Issued Patents All Time
Showing 301–325 of 635 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312140 | Dielectric gap fill evaluation for integrated circuits | Isabel Cristina Chu, Leigh Anne H. Clevenger, Ekmini Anuja De Silva, Gauri Karve, Fee Li Lie +3 more | 2019-06-04 |
| 10304815 | Self-aligned three dimensional chip stack and method for making the same | Carl Radens, Yiheng Xu, John H. Zhang | 2019-05-28 |
| 10297750 | Wraparound top electrode line for crossbar array resistive switching device | Takashi Ando, Benjamin D. Briggs, Michael Rizzolo, Chih-Chao Yang | 2019-05-21 |
| 10290541 | Barrier layers in trenches and vias | Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Chih-Chao Yang | 2019-05-14 |
| 10276190 | Sentiment analysis of mental health disorder symptoms | Maryam Ashoori, Benjamin D. Briggs, Leigh Anne H. Clevenger | 2019-04-30 |
| 10276434 | Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration | Hsueh-Chung Chen, James J. Kelly, Yann Mignot, Cornelius Brown Peethala | 2019-04-30 |
| 10276053 | Cognitive system to improve athletic performance with motivation from different training styles | Benjamin D. Briggs, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha, Michael Rizzolo | 2019-04-30 |
| 10256191 | Hybrid dielectric scheme for varying liner thickness and manganese concentration | Benjamin D. Briggs, Nicholas Anthony Lanzillo, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo | 2019-04-09 |
| 10256185 | Nitridization for semiconductor structures | Roger A. Quon, Hosadurga Shobha, Terry A. Spooner, Wei Wang, Chih-Chao Yang | 2019-04-09 |
| 10256145 | Semiconductor device and method of forming the semiconductor device | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Junli Wang, Chih-Chao Yang | 2019-04-09 |
| 10242911 | Forming self-aligned vias and air-gaps in semiconductor fabrication | Carl Radens, John H. Zhang | 2019-03-26 |
| 10243020 | Structures and methods for embedded magnetic random access memory (MRAM) fabrication | Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert | 2019-03-26 |
| 10229967 | High-density MIM capacitors | Benjamin D. Briggs, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2019-03-12 |
| 10229910 | Separate N and P fin etching for reduced CMOS device leakage | Isabel Cristina Chu, Leigh Anne H. Clevenger, Mona A. Ebrish, Gauri Karve, Fee Li Lie +3 more | 2019-03-12 |
| 10224275 | Copper interconnect structures | Wei Wang, Chih-Chao Yang | 2019-03-05 |
| 10217664 | Reflow interconnect using Ru | Su Chen Fan, Huai Huang, Koichi Motoyama, Wei Wang, Chih-Chao Yang | 2019-02-26 |
| 10211151 | Enhanced self-alignment of vias for asemiconductor device | Benjamin D. Briggs, Bartlet H. DeProspo, Michael Rizzolo, Nicole Saulnier | 2019-02-19 |
| 10211155 | Reducing metallic interconnect resistivity through application of mechanical strain | Benjamin D. Briggs, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert | 2019-02-19 |
| 10211101 | Reflow interconnect using Ru | Su Chen Fan, Huai Huang, Koichi Motoyama, Wei Wang, Chih-Chao Yang | 2019-02-19 |
| 10204828 | Enabling low resistance gates and contacts integrated with bilayer dielectrics | Ruqiang Bao, Benjamin D. Briggs, Koichi Motoyama, Cornelius Brown Peethala, Michael Rizzolo +1 more | 2019-02-12 |
| 10195901 | Smartwatch blackbox | Benjamin D. Briggs, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha, Michael Rizzolo | 2019-02-05 |
| 10192829 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Chao-Kun Hu, Takeshi Nogami, Deepika Priyadarshini, Michael Rizzolo | 2019-01-29 |
| 10170411 | Airgap protection layer for via alignment | Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo | 2019-01-01 |
| 10157832 | Integrated circuit structure including via interconnect structure abutting lateral ends of metal lines and methods of forming same | John H. Zhang, Carl Radens | 2018-12-18 |
| 10150323 | Structure, system, method, and recording medium of implementing a directed self-assembled security pattern | Benjamin D. Briggs, Bartlet H. DeProspo, Michael Rizzolo | 2018-12-11 |