Issued Patents All Time
Showing 351–375 of 635 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9972533 | Aligning conductive vias with trenches | Sean D. Burns, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more | 2018-05-15 |
| 9971341 | Crystal oscillator and the use thereof in semiconductor fabrication | Cyril Cabral, Jr., John M. Cohn, Jeffrey P. Gambino, William J. Murphy, Anthony J. Telensky | 2018-05-15 |
| 9966337 | Fully aligned via with integrated air gaps | Benjamin D. Briggs, Huai Huang, Christopher J. Penny, Michael Rizzolo, Hosadurga Shobha | 2018-05-08 |
| 9966308 | Semiconductor device and method of forming the semiconductor device | Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Junli Wang, Chih-Chao Yang | 2018-05-08 |
| 9960078 | Reflow interconnect using Ru | Su Chen Fan, Huai Huang, Koichi Motoyama, Wei Wang, Chih-Chao Yang | 2018-05-01 |
| 9953864 | Interconnect structure | Roger A. Quon, Terry A. Spooner, Wei Wang, Chih-Chao Yang | 2018-04-24 |
| 9941211 | Reducing metallic interconnect resistivity through application of mechanical strain | Benjamin D. Briggs, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert | 2018-04-10 |
| 9941134 | Uniform dielectric recess depth during fin reveal | Benjamin D. Briggs, Michael Rizzolo, Jay William Strane | 2018-04-10 |
| 9941088 | Fold over emitter and collector field emission transistor | Benjamin D. Briggs, Michael Rizzolo | 2018-04-10 |
| 9934970 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2018-04-03 |
| 9929088 | Airgap protection layer for via alignment | Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo | 2018-03-27 |
| 9916986 | Single or mutli block mask management for spacer height and defect reduction for BEOL | Benjamin D. Briggs, Yann Mignot | 2018-03-13 |
| 9911652 | Forming self-aligned vias and air-gaps in semiconductor fabrication | Carl Radens, John H. Zhang | 2018-03-06 |
| 9911651 | Skip-vias bypassing a metallization level at minimum pitch | Benjamin D. Briggs, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-03-06 |
| 9911647 | Self aligned conductive lines | Sean D. Burns, Anuja E. DeSilva, Nelson Felix, Sivananda K. Kanakasabapathy, Yann Mignot +3 more | 2018-03-06 |
| 9905511 | Modular fuses and antifuses for integrated circuits | John H. Zhang, Yiheng Xu, Carl Radens, Edem Wornyo | 2018-02-27 |
| 9905459 | Neutral atom beam nitridation for copper interconnect | Benjamin D. Briggs, Michael Rizzolo, Chih-Chao Yang | 2018-02-27 |
| 9899338 | Structure and fabrication method for enhanced mechanical strength crack stop | Benjamin D. Briggs, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-02-20 |
| 9899317 | Nitridization for semiconductor structures | Roger A. Quon, Hosadurga Shobha, Terry A. Spooner, Wei Wang, Chi-Chao Yang | 2018-02-20 |
| 9899256 | Self-aligned airgaps with conductive lines and vias | Benjamin D. Briggs, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2018-02-20 |
| 9882028 | Pitch split patterning for semiconductor devices | Kangguo Cheng, Balasubramanian Pranatharthiharan, John H. Zhang | 2018-01-30 |
| 9881431 | Security key system | Benjamin D. Briggs, Bartlet H. DeProspo, Michael Rizzolo | 2018-01-30 |
| 9858388 | Health monitoring using parallel cognitive processing | Maryam Ashoori, Benjamin D. Briggs, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha +1 more | 2018-01-02 |
| 9852946 | Self aligned conductive lines | Sean D. Burns, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more | 2017-12-26 |
| 9837485 | High-density MIM capacitors | Benjamin D. Briggs, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2017-12-05 |