Issued Patents All Time
Showing 526–550 of 635 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7563710 | Method of fabrication of interconnect structures | Chih-Chao Yang, Andrew P. Cowley, Timothy J. Dalton, Meeyoung H. Yoon | 2009-07-21 |
| 7544578 | Structure and method for stochastic integrated circuit personalization | Matthew E. Colburn, Timothy J. Dalton, Michael C. Gaidis, Louis L. Hsu, Carl Radens +2 more | 2009-06-09 |
| 7544602 | Method and structure for ultra narrow crack stop for multilevel semiconductor device | Matthew E. Colburn, William Francis Landers, Wai-Kin Li | 2009-06-09 |
| 7531407 | Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same | Timothy J. Dalton, Louis L. Hsu, Carl Radens, Vidhya Ramachandran, Keith Kwong Hon Wong +1 more | 2009-05-12 |
| 7528065 | Structure and method for MOSFET gate electrode landing pad | Timothy J. Dalton, Louis C. Hsu, Carl Radens, Kwong Hon Wong, Chih-Chao Yang | 2009-05-05 |
| 7528493 | Interconnect structure and method of fabrication of same | Chih-Chao Yang, Andrew P. Cowley, Timothy J. Dalton, Meeyoung H. Yoon | 2009-05-05 |
| 7514271 | Method of forming high density planar magnetic domain wall memory | Michael C. Gaidis, Timothy J. Dalton, John K. DeBrosse, Louis L. Hsu, Carl Radens +2 more | 2009-04-07 |
| 7494915 | Back end interconnect with a shaped interface | Andrew P. Cowley, Timothy J. Dalton, Mark Hoinkis, Steffen K. Kaldor, Erdem Kaltalioglu +8 more | 2009-02-24 |
| 7488677 | Interconnect structures with encasing cap and methods of making thereof | Kwong Hon Wong, Louis C. Hsu, Timothy J. Dalton, Carol Radens, Chih-Chao Yang +1 more | 2009-02-10 |
| 7485567 | Microelectronic circuit structure with layered low dielectric constant regions and method of forming same | Matthew E. Colburn, Louis C. Hsu, Wai-Kin Li | 2009-02-03 |
| 7473979 | Semiconductor integrated circuit devices having high-Q wafer back-side capacitors | Timothy J. Dalton, Louis L. Hsu, Carl Radens, Vidhya Ramachandran, Keith Kwong Hon Wong +1 more | 2009-01-06 |
| 7456099 | Method of forming a structure for reducing lateral fringe capacitance in semiconductor devices | Stephan Grunow, Kaushik A. Kumar, Kevin S. Petrarca, Vidhya Ramachandran, Theodorus E. Standaert | 2008-11-25 |
| 7439172 | Circuit structure with low dielectric constant regions and method of forming same | Matthew E. Colburn, Louis C. Hsu, Wai-Kin Li | 2008-10-21 |
| 7402532 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Derren N. Dunn, Chester T. Dziobkowski +7 more | 2008-07-22 |
| 7402463 | Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse application | Chih-Chao Yang, Timothy J. Dalton, Nicholas C. M. Fuller, Louis C. Hsu | 2008-07-22 |
| 7397081 | Sidewall semiconductor transistors | Huilong Zhu, Omer H. Dokumaci, Kaushik A. Kumar, Carl Radens, Dureseti Chidambarrao | 2008-07-08 |
| 7397260 | Structure and method for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Andrew P. Cowley, Ronald G. Filippi, Jason P. Gill +7 more | 2008-07-08 |
| 7348870 | Structure and method of fabricating a hinge type MEMS switch | Louis C. Hsu, Timothy J. Dalton, Carl Radens, Kwong Hon Wong, Chih-Chao Yang | 2008-03-25 |
| 7335588 | Interconnect structure and method of fabrication of same | Chih-Chao Yang, Andrew P. Cowley, Timothy J. Dalton, Meeyoung H. Yoon | 2008-02-26 |
| 7329600 | Low dielectric semiconductor device and process for fabricating the same | Louis L. Hsu, Christy S. Tyberg, Tsorng-Dih Yuan | 2008-02-12 |
| 7312529 | Structure and method for producing multiple size interconnections | Mukta G. Farooq, Louis L. Hsu, William Francis Landers, Donna S. Zupanski-Nielsen, Carl Radens +1 more | 2007-12-25 |
| 7282802 | Modified via bottom structure for reliability enhancement | Timothy J. Dalton, Louis C. Hsu, Conal E. Murray, Carl Radens, Kwong Hon Wong +1 more | 2007-10-16 |
| 7241681 | Bilayered metal hardmasks for use in dual damascene etch schemes | Kaushik A. Kumar, Timothy J. Dalton, Douglas C. La Tulipe, Jr., Andy Cowley, Erdem Kaltalioglu +5 more | 2007-07-10 |
| 7223654 | MIM capacitor and method of fabricating same | Chih-Chao Yang, Timothy J. Dalton, Louis C. Hsu | 2007-05-29 |
| 7224021 | MOSFET with high angle sidewall gate and contacts for reduced miller capacitance | Dureseti Chidambarrao, Omer H. Dokumaci, Kaushik A. Kumar, Huilong Zhu | 2007-05-29 |