Issued Patents All Time
Showing 501–525 of 635 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7830019 | Via bottom contact and method of manufacturing same | Kaushik Chanda, Andrew P. Cowley, Jason P. Gill, Baozhen Li, Chih-Chao Yang | 2010-11-09 |
| 7825019 | Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits | Stephan Grunow, Kaushik A. Kumar, Kevin S. Petrarca, Vidhya Ramachandran | 2010-11-02 |
| 7825420 | Method for forming slot via bitline for MRAM devices | Michael C. Gaidis, Carl Radens, Timothy J. Dalton, Louis L. Hsu, Keith Kwong Hon Wong +1 more | 2010-11-02 |
| 7820559 | Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer | Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Darren N. Dunn, Chester T. Dziobkowski +7 more | 2010-10-26 |
| 7821051 | MIM capacitor and method of fabricating same | Chih-Chao Yang, Timothy J. Dalton, Louis C. Hsu | 2010-10-26 |
| 7790601 | Forming interconnects with air gaps | Samuel S. Choi, Maxime Darnon, Daniel C. Edelstein, Satyanarayana V. Nitta, Shom Ponoth +1 more | 2010-09-07 |
| 7749778 | Addressable hierarchical metal wire test methodology | Kaushik Chanda, Timothy J. Dalton, Louis L. Hsu, Chih-Chao Yang | 2010-07-06 |
| 7750335 | Phase change material structure and related method | Bruce G. Elmegreen, Deok-kee Kim, Chandrasekharan Kothandaraman, Lia Krusin-Elbaum, Chung H. Lam +1 more | 2010-07-06 |
| 7732288 | Method for fabricating a semiconductor structure | Huilong Zhu, Omer H. Dokumaci, Oleg Gluschenkov, Kaushik A. Kumar, Carl Radens +1 more | 2010-06-08 |
| 7726010 | Method of forming a micro-electromechanical (MEMS) switch | Louis C. Hsu, Timothy J. Dalton, Carl Radens, Keith Kwong Hon Wong, Chih-Chao Yang | 2010-06-01 |
| 7714452 | Structure and method for producing multiple size interconnections | Mukta G. Farooq, Louis L. Hsu, William Francis Landers, Donna S. Zupanski-Nielson, Carl Radens +1 more | 2010-05-11 |
| 7696542 | Anisotropic stress generation by stress-generating liners having a sublithographic width | Bruce B. Doris, Elbert E. Huang, Sampath Purushothaman, Carl Radens | 2010-04-13 |
| 7696025 | Sidewall semiconductor transistors | Huilong Zhu, Omer H. Dokumaci, Kaushik A. Kumar, Carl Radens, Dureseti Chidambarrao | 2010-04-13 |
| 7692308 | Microelectronic circuit structure with layered low dielectric constant regions | Matthew E. Colburn, Louis C. Hsu, Wai-Kin Li | 2010-04-06 |
| 7692439 | Structure for modeling stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Andrew P. Cowley, Ronald G. Filippi, Jason P. Gill +7 more | 2010-04-06 |
| 7657995 | Method of fabricating a microelectromechanical system (MEMS) switch | Louis C. Hsu, Timothy J. Dalton, Carl Radens, Kwong Hon Wong, Chih-Chao Yang | 2010-02-09 |
| 7659160 | Field effect transistors (FETS) with inverted source/drain metallic contacts, and method of fabrication same | Michael P. Belyansky, Dureseti Chidambarrao, Kaushik A. Kumar, Carl Radens | 2010-02-09 |
| 7651892 | Electrical programmable metal resistor | Chih-Chao Yang, James J. Demarest, Louis C. Hsu, Carl Radens | 2010-01-26 |
| 7648871 | Field effect transistors (FETS) with inverted source/drain metallic contacts, and method of fabricating same | Michael P. Belyansky, Dureseti Chidambarrao, Kaushik A. Kumar, Carl Radens | 2010-01-19 |
| 7639032 | Structure for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Andrew P. Cowley, Ronald G. Filippi, Jason P. Gill +7 more | 2009-12-29 |
| 7635884 | Method and structure for forming slot via bitline for MRAM devices | Michael C. Gaidis, Carl Radens, Timothy J. Dalton, Louis L. Hsu, Keith Kwong Hon Wong +1 more | 2009-12-22 |
| 7629264 | Structure and method for hybrid tungsten copper metal contact | Griselda Bonilla, Kaushik A. Kumar, Stephan Grunow, Kevin S. Petrarca, Roger A. Quon | 2009-12-08 |
| 7598616 | Interconnect structure | Chih-Chao Yang, Andrew P. Cowley, Timothy J. Dalton, Meeyoung H. Yoon | 2009-10-06 |
| 7585764 | VIA bottom contact and method of manufacturing same | Kaushik Chanda, Andrew P. Cowley, Jason P. Gill, Baozhen Li, Chih-Chao Yang | 2009-09-08 |
| 7563704 | Method of forming an interconnect including a dielectric cap having a tensile stress | Chih-Chao Yang, Kaushik Chanda, Yun-Yu Wang, Daewon Yang | 2009-07-21 |