Issued Patents All Time
Showing 401–425 of 633 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8129286 | Reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2012-03-06 |
| 8125049 | MIM capacitor structure in FEOL and related method | Douglas D. Coolbaugh, Ebenezer E. Eshun, Robert M. Rassel | 2012-02-28 |
| 8119522 | Method of fabricating damascene structures | Jeffrey P. Gambino, Peter J. Lindgren | 2012-02-21 |
| 8120143 | Integrated circuit comb capacitor | Daniel C. Edelstein, Anil K. Chinthakindi, Timothy J. Dalton, Ebenezer E. Eshun, Jeffrey P. Gambino +1 more | 2012-02-21 |
| 8119491 | Methods of fabricating passive element without planarizing and related semiconductor device | Anil K. Chinthakindi, Timothy J. Dalton, Ebenezer E. Eshun, Jeffrey P. Gambino, Kunal Vaed | 2012-02-21 |
| 8106513 | Copper damascene and dual damascene interconnect wiring | Jeffrey P. Gambino, William R. Hill, Kenneth E. McAvey, Jr., Thomas L. McDevitt, Arthur C. Winslow +1 more | 2012-01-31 |
| 8093679 | Integrated BEOL thin film resistor | Anil K. Chinthakindi, Douglas D. Coolbaugh, John M. Cotte, Ebenezer E. Eshun, Zhong-Xiang He +1 more | 2012-01-10 |
| 8089135 | Back-end-of-line wiring structures with integrated passive elements and design structures for a radiofrequency integrated circuit | Peter J. Lindgren | 2012-01-03 |
| 8089126 | Method and structures for improving substrate loss and linearity in SOI substrates | Alan B. Botula, David S. Collins, Alvin J. Joseph, Howard S. Landis, James A. Slinkman | 2012-01-03 |
| 8053901 | Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner | Jeffrey P. Gambino | 2011-11-08 |
| 8052799 | By-product collecting processes for cleaning processes | Edward C. Cooney, III, William J. Murphy, David C. Strippe | 2011-11-08 |
| 8039356 | Through silicon via lithographic alignment and registration | Russell T. Herrin, Peter J. Lindgren, Edmund J. Sprogis | 2011-10-18 |
| 8039354 | Passive components in the back end of integrated circuits | Anil K. Chinthakindi, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Jeffrey B. Johnson +2 more | 2011-10-18 |
| 8035198 | Through wafer via and method of making same | Hanyi Ding, Alvin J. Joseph | 2011-10-11 |
| 8028924 | Device and method for providing an integrated circuit with a unique identification | Brent A. Anderson, Andres Bryant, Alain Loiseau, Mickey H. Yu | 2011-10-04 |
| 8026606 | Interconnect layers without electromigration | Stephen E. Luce, Thomas L. McDevitt | 2011-09-27 |
| 8013367 | Structure and method for compact long-channel FETs | Bruce B. Doris, Carl Radens | 2011-09-06 |
| 8013342 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke +1 more | 2011-09-06 |
| 7994895 | Heat sink for integrated circuit devices | Douglas D. Coolbaugh, Ebenezer E. Eshun, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis +1 more | 2011-08-09 |
| 7989312 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke +1 more | 2011-08-02 |
| 7972965 | Process for interfacial adhesion in laminate structures through patterned roughing of a surface | Edward C. Cooney, III, Vincent J. McGahay, Thomas M. Shaw, Matthew E. Colburn | 2011-07-05 |
| 7968975 | Metal wiring structure for integration with through substrate vias | David S. Collins, Alvin J. Joseph, Peter J. Lindgren, Kimball M. Watson | 2011-06-28 |
| 7960245 | Dual wired integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke | 2011-06-14 |
| 7943428 | Bonded semiconductor substrate including a cooling mechanism | Jeffrey P. Gambino | 2011-05-17 |
| 7939914 | Dual wired integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Paul D. Kartschoke | 2011-05-10 |