Issued Patents 2022
Showing 26–50 of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508665 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai | 2022-11-22 |
| 11508695 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2022-11-22 |
| 11502072 | Integrated circuit package and method | Yung-Chi Lin, Wen-Chih Chiou | 2022-11-15 |
| 11502013 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2022-11-15 |
| 11495590 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2022-11-08 |
| 11493689 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu | 2022-11-08 |
| 11495573 | Package structure and manufacturing method thereof | Chung-Hao Tsai, Chuei-Tang Wang | 2022-11-08 |
| 11488909 | Package structure | Chun-Wen Lin, Chung-Hao Tsai, Chuei-Tang Wang, Che-Wei Hsu | 2022-11-01 |
| 11488881 | Semiconductor device and method of manufacture | Chien-Hsun Lee, Jiun Yi Wu | 2022-11-01 |
| 11488897 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2022-11-01 |
| 11488908 | Semiconductor device and method | Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2022-11-01 |
| 11487060 | Semiconductor device with nanostructures aligned with grating coupler and manufacturing method thereof | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Tsang-Jiuh Wu, Wen-Chih Chiou | 2022-11-01 |
| 11482465 | Thermal interface materials, 3D semiconductor packages and methods of manufacture | Szu-Wei Lu, Ying-Ching Shih, Li-Chung Kuo | 2022-10-25 |
| 11482484 | Symmetrical substrate for semiconductor packaging | Jiun Yi Wu | 2022-10-25 |
| 11482788 | Antenna device and method for manufacturing antenna device | Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee | 2022-10-25 |
| 11470720 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2022-10-11 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2022-10-11 |
| 11469166 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2022-10-11 |
| 11469197 | Integrated circuit package and method | Wen-Chih Chiou, Shih-Ting Lin, Szu-Wei Lu | 2022-10-11 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chi-Hsi Wu, Wen-Chih Chiou, Tsang-Jiuh Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2022-10-11 |
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2022-10-04 |
| 11462530 | Multi-stack package-on-package structures | An-Jhih Su | 2022-10-04 |
| 11462495 | Chiplets 3D SoIC system integration and fabrication methods | Kuo-Chung Yee | 2022-10-04 |
| 11462531 | Multi-stack package-on-package structures | An-Jhih Su | 2022-10-04 |
| 11460633 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang | 2022-10-04 |