Issued Patents 2017
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847317 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Hui-Min Huang, Chih-Fan Huang | 2017-12-19 |
| 9837278 | Wafer level chip scale package and method of manufacturing the same | Yu-Hsiang Hu, Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Chung-Shi Liu | 2017-12-05 |
| 9818729 | Package-on-package structure and method | Sheng-Hsiang Chiu, Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Feng Weng | 2017-11-14 |
| 9812427 | Package on-package (PoP) structure including stud bulbs | Chen-Hua Yu, Mirng-Ji Lii, Chung-Shi Liu | 2017-11-07 |
| 9802349 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen +1 more | 2017-10-31 |
| 9799631 | Semiconductor packaging structure and method | Chun-Cheng Lin, Chung-Shi Liu, Kuei-Wei Huang, Cheng-Ting Chen, Wei-Hung Lin | 2017-10-24 |
| 9786622 | Semiconductor package | Chih-Wei Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Chung-Shi Liu | 2017-10-10 |
| 9786631 | Device package with reduced thickness and method for forming same | Chen-Hua Yu, Meng-Tse Chen, Chung-Shi Liu | 2017-10-10 |
| 9780064 | Method of forming package assembly | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Chung-Shi Liu | 2017-10-03 |
| 9768048 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Chung-Shi Liu | 2017-09-19 |
| 9768137 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Chung-Shi Liu | 2017-09-19 |
| 9768136 | Interconnect structure and method of fabricating same | Wen-Hsiung Lu, Wei-Yu Chen, Hsuan-Ting Kuo, Chung-Shi Liu | 2017-09-19 |
| 9761551 | Solder joint structure for ball grid array in wafer level package | Yu-Hsiang Hu, Wei-Yu Chen, Wei-Hung Lin, Chung-Shi Liu | 2017-09-12 |
| 9754805 | Packaging method and structure | Chen-Hua Yu, Ching-Hua Hsieh, Chung-Shi Liu | 2017-09-05 |
| 9754908 | Wafer with liquid molding compound and post-passivation interconnect | Chung-Shi Liu, Chia-Wei Tu, Wen-Hsiung Lu, Yu-Peng Tsai | 2017-09-05 |
| 9728427 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Chun-Hung Lin, Chung-Shi Liu, Mirng-Ji Lii | 2017-08-08 |
| 9711470 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Mirng-Ji Lii, Meng-Tse Chen, Wei-Hung Lin | 2017-07-18 |
| 9698028 | Semiconductor package and method of manufacturing the same | Wen-Hsiung Lu, Yi-Wen Wu, Yu-Peng Tsai, Chia-Wei Tu, Chung-Shi Liu | 2017-07-04 |
| 9691745 | Bonding structure for forming a package on package (PoP) structure and method for forming the same | James Hu, Chung-Shi Liu | 2017-06-27 |
| 9691726 | Methods for forming fan-out package structure | Hsien-Wei Chen, Cheng-Lin Huang, Meng-Tse Chen, Chung-Shi Liu | 2017-06-27 |
| 9679790 | Singulation apparatus and method | Chun-Cheng Lin, Yu-Peng Tsai, Meng-Tse Chen, Chung-Shi Liu | 2017-06-13 |
| 9679836 | Package structures and methods for forming the same | Ching-Wen Hsiao, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2017-06-13 |
| 9673182 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Meng-Tse Chen, Wei-Hung Lin, Chung-Shi Liu | 2017-06-06 |
| 9666572 | Process for forming package-on-package structures | Chih-Wei Lin, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2017-05-30 |
| 9659805 | Fan-out interconnect structure and methods forming the same | Yu-Hsiang Hu, Chung-Shi Liu, Hung-Jui Kuo | 2017-05-23 |