Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847317 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng | 2017-12-19 |
| 9818729 | Package-on-package structure and method | Sheng-Hsiang Chiu, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Feng Weng, Ming-Da Cheng | 2017-11-14 |
| 9802349 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Ming-Da Cheng +1 more | 2017-10-31 |
| 9786631 | Device package with reduced thickness and method for forming same | Chen-Hua Yu, Ming-Da Cheng, Chung-Shi Liu | 2017-10-10 |
| 9768137 | Stud bump structure for semiconductor package assemblies | Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9711470 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Wei-Hung Lin | 2017-07-18 |
| 9691726 | Methods for forming fan-out package structure | Ming-Da Cheng, Hsien-Wei Chen, Cheng-Lin Huang, Chung-Shi Liu | 2017-06-27 |
| 9679790 | Singulation apparatus and method | Chun-Cheng Lin, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2017-06-13 |
| 9673182 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-06-06 |
| 9666572 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2017-05-30 |
| 9627369 | Packages and methods for forming the same | Chun-Cheng Lin, Yu-Peng Tsai, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-04-18 |
| 9627355 | Package-on-package structure having polymer-based material for warpage control | Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2017-04-18 |
| 9576888 | Package on-package joint structure with molding open bumps | Chun-Cheng Lin, Wei-Yu Chen, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2017-02-21 |