Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824989 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Jing-Cheng Lin | 2017-11-21 |
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Wen-Yi Lin, Ming-Chih Yew +4 more | 2017-08-29 |
| 9711472 | Solder bump for ball grid array | Jung-Hua Chang, Jing-Cheng Lin | 2017-07-18 |
| 9711475 | Bump structural designs to minimize package defects | Jing-Cheng Lin | 2017-07-18 |
| 9691726 | Methods for forming fan-out package structure | Ming-Da Cheng, Hsien-Wei Chen, Meng-Tse Chen, Chung-Shi Liu | 2017-06-27 |
| 9653423 | Integrated circuit structure having dies with connectors | Jing-Cheng Lin | 2017-05-16 |
| 9595510 | Structure and formation method for chip package | Jui-Pin Hung, Hsien-Wen Liu, Shin-Puu Jeng | 2017-03-14 |