Issued Patents 2017
Showing 1–25 of 101 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852998 | Ring structures in device die | Ying-Ju Chen, Jie Chen | 2017-12-26 |
| 9852957 | Testing, manufacturing, and packaging methods for semiconductor devices | Li-Hsien Huang, Yung-Shou Cheng, Yan-Fu Lin, An-Jhih Su, Wei-Cheng Wu +2 more | 2017-12-26 |
| 9842788 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2017-12-12 |
| 9842829 | Chip package structure and method for forming the same | Shao-Yun Chen, An-Jhih Su | 2017-12-12 |
| 9837379 | Discrete polymer in fan-out packages | Jie Chen | 2017-12-05 |
| 9831215 | Semiconductor package and forming method thereof | Li-Hsien Huang, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen | 2017-11-28 |
| 9831214 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen | 2017-11-28 |
| 9831196 | Methods and apparatus of guard rings for wafer-level-packaging | Tsung-Yuan Yu | 2017-11-28 |
| 9831205 | Semiconductor device and manufacturing method thereof | Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2017-11-28 |
| 9831140 | Wafer having pad structure | Ying-Ju Chen, Hao-Yi Tsai, Mirng-Ji Lii | 2017-11-28 |
| 9824990 | Pad design for reliability enhancement in packages | — | 2017-11-21 |
| 9825007 | Chip package structure with molding layer and method for forming the same | Wei-Yu Chen, Li-Hsien Huang, An-Jhih Su | 2017-11-21 |
| 9825008 | Package-on-package device with supplemental underfill and method for manufacturing the same | Ying-Ju Chen, Jie Chen | 2017-11-21 |
| 9818700 | Stress relief structures in package assemblies | — | 2017-11-14 |
| 9812381 | Integrated fan-out package and method of fabricating the same | Chi-Hsi Wu, Chun-Yi Liu, Der-Chyang Yeh, Shih-Peng Tai, Chuen-De Wang | 2017-11-07 |
| 9812392 | Inductor system and method | Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu | 2017-11-07 |
| 9812426 | Integrated fan-out package, semiconductor device, and method of fabricating the same | Chin-Te Wang, Cheng-Hsien Hsieh, Li-Han Hsu, Tzu-Shiun Sheu, Wei-Cheng Wu +1 more | 2017-11-07 |
| 9812434 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2017-11-07 |
| 9812430 | Package on-package method | An-Jhih Su, Ying-Ju Chen | 2017-11-07 |
| 9812337 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2017-11-07 |
| 9806042 | Strain reduced structure for IC packaging | Ying-Ju Chen, Tsung-Yuan Yu, Yu-Feng Chen, Tsung-Ding Wang | 2017-10-31 |
| 9806059 | Multi-stack package-on-package structures | Chi-Jung Lee, An-Jhih Su, Wei-Yu Chen, Tien-Chung Yang, Li-Hsien Huang | 2017-10-31 |
| 9799582 | Bump structure design for stress reduction | — | 2017-10-24 |
| 9799614 | Calibration kits for RF passive devices | Jie Chen, Hao-Yi Tsai, Hung-Yi Kuo | 2017-10-24 |
| 9793231 | Under bump metallurgy (UBM) and methods of forming same | Wei-Yu Chen, An-Jhih Su, Cheng-Hsien Hsieh | 2017-10-17 |